Integrated power module package
An integrated power module includes a substantially planar insulated metal substrate having at least one cut-out region; at least one substantially planar ceramic substrate disposed within the cut-out region, wherein the ceramic substrate is framed on at least two sides by the insulated metal substrate, the ceramic substrate including a first metal layer on a first side and a second metal layer on a second side; at least one power semiconductor device coupled to the first side of the ceramic substrate; at least one control device coupled to a first surface of the insulated metal substrate; a power overlay electrically connecting the at least one semiconductor power device and the at least one control device; and a cooling fluid reservoir operatively connected to the second metal layer of the at least one ceramic substrate, wherein a plurality of cooling fluid passages are provided in the cooling fluid reservoir.
1. An integrated power module, comprising:
a substantially planar insulated metal substrate having at least one cut-out region;
at least one substantially planar ceramic substrate disposed within the cut-out region, wherein the ceramic substrate is framed on at least two sides by the insulated metal substrate, the ceramic substrate including a first metal layer on a first side and a second metal layer on a second side;
at least one power semiconductor device coupled to the first side of the ceramic substrate;
at least one control device coupled to a first surface of the insulated metal substrate;
a power overlay electrically connecting the at least one semiconductor power device and the at least one control device; and
a cooling fluid reservoir operatively connected to the second metal layer of the at least one ceramic substrate, wherein a plurality of cooling fluid passages are provided in the cooling fluid reservoir.
2. The integrated power module of claim 1 , wherein the cooling fluid reservoir is integrally formed with the second metal layer of the at least one ceramic substrate.
3. The integrated power module of claim 1 , wherein the cooling fluid passages are integrally formed in the second metal layer of the at least one ceramic substrate.
4. The integrated power module of claim 1 , wherein the cooling fluid reservoir is attached to the second metal layer of the at least one ceramic substrate.
5. The integrated power module of claim 1 , wherein the cooling fluid reservoir is attached to the second metal layer by solder.
6. The integrated power module of claim 1 , further comprising a seal provided between the cooling fluid reservoir and the second metal layer.
7. The integrated power module of claim 1 , wherein at least one gap is formed between the at least one ceramic substrate and the insulated metal substrate and the at least one gap is filled by filler material.
8. The integrated power module of claim 7 , wherein the filler material comprises epoxy.
9. The integrated power module of claim 1 , wherein the insulated metal substrate comprises a protrusion configured to engage the at least one ceramic substrate and exert pressure on the ceramic substrate.
10. The integrated power module of claim 1 , further comprising at least one fastener configured to align and secure the insulated metal substrate to at least one heatsink.
11. The integrated power module of claim 1 , further comprising a plurality of thermal vias provided between the second metal layer of the at least one ceramic substrate and extending through an insulating material layer of the insulated metal substrate.