Multilayer ceramic electronic component and method of manufacturing the same
There is provided a multilayer ceramic electronic component, including: a ceramic body having dielectric layers and first and second internal electrodes alternately stacked therein; and first and second external electrodes electrically connected to the first and second internal electrodes and formed at both ends of the ceramic body, wherein the ceramic body includes an effective layer contributing to capacitance formation and a protective layer provided on at least one of upper and lower surfaces of the effective layer, the protective layer including one or more step absorbing layers provided at both ends thereof, so that the multilayer ceramic electronic component can have excellent reliability by reducing defects such as electrode spreading, cracks, delamination and the like.
1. A multilayer ceramic electronic component, comprising:
a ceramic body having dielectric layers and first and second internal electrodes alternately stacked therein; and
first and second external electrodes electrically connected to the first and second internal electrodes and formed at both ends of the ceramic body,
wherein the ceramic body includes an effective layer contributing to capacitance formation and a protective layer provided on at least one of upper and lower surfaces of the effective layer, the protective layer including one or more step absorbing layers provided at both ends thereof.
2. The multilayer ceramic electronic component of claim 1 , wherein the step absorbing layer has a thickness of 0.5 μm to 3 μm.
3. The multilayer ceramic electronic component of claim 1 , wherein a ratio of the number of stacked step adsorbing layers to the number of stacked dielectric layers included in the protective layer is 0.5 to 1.
4. The multilayer ceramic electronic component of claim 1 , wherein the step absorbing layer is formed in a region of the protective layer corresponding to a margin portion of the effective layer.
5. The multilayer ceramic electronic component of claim 1 , wherein the first and second internal electrodes are formed of at least one selected from the group consisting of copper (Cu), nickel (Ni), silver (Ag), and sliver-palladium (Ag—Pd).
6. A method of manufacturing a multilayer ceramic electronic component, the method comprising:
preparing ceramic green sheets;
forming internal electrode patterns on the ceramic green sheets by using a conductive metal paste;
forming a ceramic body including dielectric layers and first and second internal electrodes by stacking the ceramic green sheets; and
forming first and second external electrodes electrically connected to the first and second internal electrodes,
wherein the ceramic body includes an effective layer contributing to capacitance formation and a protective layer provided on at least one of upper and lower surfaces of the effective layer, the protective layer including one or more step absorbing layers provided at both ends thereof.
7. The method of claim 6 , wherein the step absorbing layer is formed in a region of the protective layer corresponding to a margin portion of the effective layer.
8. The method of claim 6 , wherein the step absorbing layer has a thickness of 1 μm to 3 μm.
9. The method of claim 6 , wherein a ratio of the number of stacked step adsorbing layers to the number of stacked dielectric layers included in the protective layer is 0.5 to 1.
10. The method of claim 6 , wherein the conductive metal paste includes at least one selected from the group consisting of copper (Cu), nickel (Ni), silver (Ag), and sliver-palladium (Ag—Pd).