MEMS pressure transducer assembly and method of packaging same
An assembly ( 20 ) includes a MEMS die ( 22 ) having a pressure transducer device ( 40 ) formed on a substrate ( 44 ) and a cap layer ( 38 ). A packaging process ( 74 ) entails forming the device ( 40 ) on the substrate, creating an aperture ( 70 ) through a back side ( 58 ) of the substrate ( 44 ) underlying a diaphragm ( 46 ) of the device ( 40 ), and coupling a cap layer ( 38 ) to the front side of the substrate ( 44 ) overlying the device ( 40 ). A trench ( 54 ) is produced extending through both the cap layer ( 38 ) and the substrate ( 44 ), and surrounds a cantilevered platform ( 48 ) at which the diaphragm ( 46 ) resides. The die ( 22 ) is suspended above a substrate ( 26 ) so that a clearance space ( 60 ) is formed between the platform ( 48 ) and the substrate ( 26 ). The diaphragm ( 46 ) is exposed to an external environment ( 68 ) via the aperture ( 70 ) and the space ( 60 ), and an external port.
1. A method of making a microelectromechanical systems (MEMS) device package comprising:
forming a MEMS device on a front side of a device substrate;
removing a portion of said device substrate to form an aperture extending through said device substrate underlying an active region of said MEMS device;
coupling a cap layer to said front side of said device substrate overlying said MEMS device; and
removing a section of each of said cap layer and said device substrate partially surrounding said MEMS device to form a cantilevered platform at which said active region resides, wherein at least a portion of said cap layer is attached to said cantilevered platform to form a sealed cavity in which said active region is located.
2. A method as claimed in claim 1 wherein said forming said MEMS device produces a pressure transducer having a movable diaphragm in said active region, said movable diaphragm being exposed to an external environment via said aperture.
3. A method as claimed in claim 2 wherein following said removing operation, said movable diaphragm is movable relative to said cantilevered platform.
4. A method as claimed in claim 1 wherein said operation of removing said section comprises etching through an entire thickness of said cap layer and said device substrate to form said cantilevered platform having a sole attachment point to said device substrate surrounding said cantilevered platform.
5. A method as claimed in claim 1 further comprising attaching a back side of said device substrate to a base substrate, said attaching operation including forming a clearance space between said cantilevered platform and said base substrate so that said cantilevered platform is suspended above said base substrate.
6. A method as claimed in claim 5 wherein said forming said clearance space comprises providing a cutout in said base substrate underlying said cantilevered platform.
7. A method as claimed in claim 6 wherein said cutout extends through an entirety of said base substrate so that said active region is exposed to an external environment via said cutout, said clearance space, and said aperture.
8. A method as claimed in claim 5 wherein said forming said clearance space comprises applying an adhesive to attach said back side of said device substrate to said base substrate, said adhesive having a thickness sufficient to produce said clearance space underlying said cantilevered platform.
9. A method as claimed in claim 5 wherein said operation of removing said section produces a trench extending through said cap layer and said device substrate surrounding said cantilevered platform, and said clearance space and said aperture are in communication with said trench so that said active region is exposed to an external environment via said trench, said clearance space, and said aperture.
10. A method as claimed in claim 9 further comprising:
positioning a plug member over said trench and said cap layer overlying said cantilevered platform;
following said positioning operation, applying a molding compound to substantially encapsulate said MEMS device, said cap layer, said device substrate, and said base substrate; and
following said applying operation, replacing said plug member with a protective cap over said trench and said cap layer overlying said cantilevered platform, said protective cap including a port extending through said cap to expose said trench to said external environment.
11. A method as claimed in claim 1 wherein:
said forming operation includes forming conductive traces at said front side of said device substrate, and said cap layer covers said conductive traces such that said conductive traces reside in said sealed cavity.
12. A method of making a microelectromechanical systems (MEMS) device package comprising:
forming a MEMS device on a front side of a device substrate;
removing a portion of said device substrate to form an aperture extending through said device substrate underlying an active region of said MEMS device;
coupling a cap layer to said front side of said device substrate overlying said MEMS device;
removing a section of each of said cap layer and said device substrate by etching through an entirety of a thickness of said cap layer and said device substrate partially surrounding said MEMS device to form a cantilevered platform at which said active region resides, wherein at least a portion of said cap layer is coupled to said cantilevered platform to form a sealed cavity in which said active region is located; and
attaching a back side of said device substrate to a base substrate, said attaching operation including forming a clearance space between said cantilevered platform and said base substrate so that said cantilevered platform is suspended above said base substrate.
13. A method as claimed in claim 12 wherein said forming said clearance space comprises providing a cutout in said base substrate underlying said cantilevered platform, said cutout extending through an entire thickness said base substrate so that said active region is exposed to an external environment via said cutout, said clearance space, and said aperture.
14. A method as claimed in claim 12 wherein said operation of removing said section produces a trench extending through said cap layer and said device substrate surrounding said cantilevered platform, and said clearance space and said aperture are in communication with said trench so that said active region is exposed to an external environment via said trench, said clearance space, and said aperture.
15. A method as claimed in claim 12 wherein following said removing operation, said movable diaphragm is movable relative to said cantilevered platform.
16. A method of making a microelectromechanical systems (MEMS) device package comprising:
forming a MEMS pressure transducer having a movable diaphragm on a front side of a device substrate;
removing a portion of said device substrate to form an aperture extending through said device substrate underlying an active region of said MEMS device, said movable diaphragm being located in said active region;
coupling a cap layer to said front side of said device substrate overlying said MEMS device;
removing a section of each of said cap layer and said device substrate partially surrounding said MEMS device to form a cantilevered platform at which said active region resides, wherein following said removing operation, said movable diaphragm is movable relative to said cantilevered platform; and
attaching a back side of said device substrate to a base substrate, said attaching operation including forming a clearance space between said cantilevered platform and said base substrate so that said cantilevered platform is suspended above said base substrate.
17. A method as claimed in claim 16 wherein said operation of removing said section comprises etching through an entire thickness of said cap layer and said device substrate to form said cantilevered platform having a sole attachment point to said device substrate surrounding said cantilevered platform.
18. A method as claimed in claim 16 wherein said operation of removing said section produces a trench extending through said cap layer and said device substrate surrounding said cantilevered platform, and said clearance space and said aperture are in communication with said trench so that said movable diaphragm is exposed to an external environment via said trench, said clearance space, and said aperture.
19. A method as claimed in claim 18 wherein:
said forming operation includes forming conductive traces at said front side of said device substrate, and said cap layer covers said conductive traces such that said conductive traces reside in said sealed cavity, said sealed cavity being isolated from said external environment.
20. A method as claimed in claim 16 wherein following said removing operation, at least a portion of said cap layer is coupled to said cantilevered platform to form a sealed cavity in which said movable diaphragm is located.