Method of manufacturing light emitting device

1. A method of manufacturing a light emitting device, the method comprising:

providing a substrate;

establishing metallization on an upper surface of the substrate;

mounting a light emitting element on top of the metallization, and connecting electrically the metallization and light emitting element; covering continuously, with insulating material, the surfaces of metallization and at least side surface of the light emitting element; and

providing light reflective resin over the insulating material at a position surrounding the light emitting element to reflect light from the light emitting element,

wherein said providing the substrate comprises forming the substrate in a manner that defines

a first cavity;

a second cavity inside the first cavity with a bottom surface positioned below the first cavity; and

a mounting surface surrounded by the second cavity, the mounting surface being higher than the bottom surface of the second cavity,

wherein said establishing metallization comprises establishing metallization on the mounting surface of the substrate and the bottom surface of the second cavity,

wherein said mounting the light emitting element comprises mounting the light emitting element on top of the metallization established on the mounting surface of the substrate,

wherein said covering with the insulating material comprises covering continuously, with insulating material, the surfaces of metallization on the bottom surfaces inside the second cavity, an inside wall that joins with the first cavity, the surface of metallization on the mounting surface in the first cavity, and at least side surface of the light emitting element, and

wherein said providing the light reflective resin comprises providing the light reflective resin in the second cavity to reflect light from the light emitting element.

2. The method of claim 1 , further comprising

filling an inside surrounded by the light reflective resin with encapsulating material to encapsulate the light emitting element and the insulating material around the light emitting element.

3. The method of claim 1 , wherein said providing the light reflective resin comprises forming the light reflective resin to protrude from a horizontal plane higher than the light emitting element.

4. The method of claim 1 ,

wherein said mounting the light emitting element comprises connecting electrically the metallization and light emitting element with conducting wire, and

wherein said covering with insulating material comprises covering continuously, with insulating material, the surfaces of metallization, the side surface and an upper surface of the light emitting element, and the conducting wire.

5. The method of claim 1 ,

wherein said providing the substrate comprises forming the substrate in approximately sheet form to establish an approximately planar surface of the substrate for mounting the light emitting element on, and

wherein said providing the light reflective resin comprises providing the light reflective resin on a same horizontal surface of the substrate where the light emitting element is mounted.

6. The method of claim 2 ,

wherein said mounting the light emitting element comprises connecting electrically the metallization and light emitting element with conducting wire, and

wherein said covering with insulating material comprises covering continuously, with insulating material, the surfaces of metallization, the side surface and an upper surface of the light emitting element, and the conducting wire.

7. The method of claim 1 , wherein said light emitting element comprises nitride semiconductor made of In X Al Y Ga 1-X-Y N (0≦X, 0≦Y, X+Y≦1).