Semiconductor device and manufacturing method thereof
View Patent ↗One object of the present invention is to provide a structure of a transistor including an oxide semiconductor in a channel formation region in which the threshold voltage of electric characteristics of the transistor can be positive, which is a so-called normally-off switching element, and a manufacturing method thereof. A second oxide semiconductor layer which has greater electron affinity and a smaller energy gap than a first oxide semiconductor layer is formed over the first oxide semiconductor layer. Further, a third oxide semiconductor layer is formed to cover side surfaces and a top surface of the second oxide semiconductor layer, that is, the third oxide semiconductor layer covers the second oxide semiconductor layer.
1. A semiconductor device comprising:
a first oxide semiconductor layer;
a second oxide semiconductor layer over the first oxide semiconductor layer;
a third oxide semiconductor layer provided over the second oxide semiconductor layer to cover side surfaces of the second oxide semiconductor layer;
a source electrode layer and a drain electrode layer over the third oxide semiconductor layer;
a gate insulating film over the source electrode layer and the drain electrode layer; and
a gate electrode layer over the gate insulating film to overlap with the first oxide semiconductor layer, the second oxide semiconductor layer, and the third oxide semiconductor layer,
wherein the second oxide semiconductor layer has a smaller energy gap than the first oxide semiconductor layer and the third oxide semiconductor layer.
2. The semiconductor device according to claim 1 , wherein the third oxide semiconductor layer is in contact with part of a top surface of the first oxide semiconductor layer.
3. The semiconductor device according to claim 1 ,
wherein the first oxide semiconductor layer is formed over and in contact with an oxide insulating film, and
wherein in the oxide insulating film, a thickness of a region in contact with the third oxide semiconductor layer is smaller than a thickness of a region in contact with the first oxide semiconductor layer.
4. The semiconductor device according to claim 1 , wherein the second oxide semiconductor layer has greater electron affinity than the first oxide semiconductor layer and the third oxide semiconductor layer.
5. The semiconductor device according to claim 1 ,
wherein the third oxide semiconductor layer covers entirely side surfaces of the second oxide semiconductor layer.
6. The semiconductor device according to claim 1 ,
wherein the second oxide semiconductor layer comprises In—Sn—Zn-based oxide.
7. A semiconductor device comprising:
a first oxide semiconductor layer;
a second oxide semiconductor layer over the first oxide semiconductor layer;
a third oxide semiconductor layer provided over the second oxide semiconductor layer to cover side surfaces of the first oxide semiconductor layer and side surfaces of the second oxide semiconductor layer;
a source electrode layer and a drain electrode layer over the third oxide semiconductor layer;
a gate insulating film over the source electrode layer and the drain electrode layer; and
a gate electrode layer over the gate insulating film to overlap with the first oxide semiconductor layer, the second oxide semiconductor layer, and the third oxide semiconductor layer,
wherein the second oxide semiconductor layer has a smaller energy gap than the first oxide semiconductor layer and the third oxide semiconductor layer.
8. The semiconductor device according to claim 7 ,
wherein the first oxide semiconductor layer is formed over and in contact with an oxide insulating film, and
wherein in the oxide insulating film, a thickness of a region in contact with the third oxide semiconductor layer is smaller than a thickness of a region in contact with the first oxide semiconductor layer.
9. The semiconductor device according to claim 7 , wherein the second oxide semiconductor layer has greater electron affinity than the first oxide semiconductor layer and the third oxide semiconductor layer.
10. The semiconductor device according to claim 7 ,
wherein the third oxide semiconductor layer covers entirely side surfaces of the first oxide semiconductor layer and entirely side surfaces of the second oxide semiconductor layer.
11. The semiconductor device according to claim 7 ,
wherein the second oxide semiconductor layer comprises In—Sn—Zn-based oxide.
12. A semiconductor device comprising:
a first oxide semiconductor layer;
a second oxide semiconductor layer over the first oxide semiconductor layer;
a third oxide semiconductor layer provided over the second oxide semiconductor layer to cover side surfaces of the second oxide semiconductor layer;
a gate electrode layer overlapped with the first oxide semiconductor layer, the second oxide semiconductor layer, and the third oxide semiconductor layer; and
a gate insulating film between the gate electrode layer and a stack of the first, second and third oxide semiconductor layers,
wherein the third oxide semiconductor layer comprises indium, gallium, and zinc, and
wherein the second oxide semiconductor layer has a smaller energy gap than the first oxide semiconductor layer and the third oxide semiconductor layer.
13. The semiconductor device according to claim 12 , wherein the third oxide semiconductor layer is in contact with part of a top surface of the first oxide semiconductor layer.
14. The semiconductor device according to claim 12 ,
wherein the third oxide semiconductor layer covers entirely side surfaces of the second oxide semiconductor layer.
15. The semiconductor device according to claim 12 ,
wherein the second oxide semiconductor layer comprises In—Sn—Zn-based oxide.
16. A semiconductor device comprising:
a first gate electrode;
a gate insulating film over the first gate electrode;
a first oxide semiconductor layer over the gate insulating film;
a second oxide semiconductor layer over the first oxide semiconductor layer;
a third oxide semiconductor layer provided over the second oxide semiconductor layer to cover side surfaces of the second oxide semiconductor layer;
a second gate insulating film over the third oxide semiconductor layer; and
a second gate electrode layer over the second gate insulating film to overlap with the first oxide semiconductor layer, the second oxide semiconductor layer, and the third oxide semiconductor layer,
wherein the second oxide semiconductor layer has a smaller energy gap than the first oxide semiconductor layer and the third oxide semiconductor layer.
17. The semiconductor device according to claim 16 , wherein the third oxide semiconductor layer is in contact with part of a top surface of the first oxide semiconductor layer.
18. The semiconductor device according to claim 16 ,
wherein the third oxide semiconductor layer covers entirely side surfaces of the second oxide semiconductor layer.
19. The semiconductor device according to claim 16 ,
wherein the second oxide semiconductor layer comprises In—Sn—Zn-based oxide.