Polysilicon design for replacement gate technology
The present disclosure provides an integrated circuit. The integrated circuit includes a semiconductor substrate; and a passive polysilicon device disposed over the semiconductor substrate. The passive polysilicon device further includes a polysilicon feature; and a plurality of electrodes embedded in the polysilicon feature.
1. An integrated circuit, comprising:
a semiconductor substrate; and
a passive polysilicon device disposed over the semiconductor substrate, the passive polysilicon device including:
a conductive layer formed over the semiconductor substrate and formed of a conductive material;
a polysilicon feature formed on the conductive layer and formed of a polysilicon material, the polysilicon material being different than the conductive material;
a sidewall spacer disposed along a sidewall of the polysilicon feature and a sidewall of the conductive layer; and
a plurality of electrodes embedded in the polysilicon feature, wherein a portion of the polysilicon feature extends from an edge of one of the plurality of electrodes to the sidewall spacer, wherein the edge faces the sidewall spacer.
2. The integrated circuit of claim 1 , further comprising a high k dielectric layer interposed between the semiconductor substrate and the passive polysilicon device.
3. The integrated circuit of claim 1 , wherein the plurality of electrodes include heavily doped polysilicon and the polysilicon feature includes one of non-doped polysilicon and lightly doped polysilicon.
4. The integrated circuit of claim 3 , wherein the plurality of electrodes further include silicide disposed on the heavily doped polysilicon.
5. The integrated circuit of claim 1 , wherein the plurality of electrodes comprises:
a first subset of the electrodes configured to be applicable for a first electric potential; and
a second subset of the electrodes configured to be applicable for a second electric potential.
6. The integrated circuit of claim 1 , wherein the passive polysilicon device comprises at least one of a polysilicon resistor and a polysilicon fuse.
7. The integrated circuit of claim 1 , wherein the passive polysilicon device is disposed over a shallow trench isolation (STI) disposed in the semiconductor substrate.
8. An integrated circuit, comprising:
a semiconductor substrate;
a passive polysilicon device disposed over the semiconductor substrate, the passive polysilicon device including:
a polysilicon feature;
a sidewall spacer disposed along a sidewall of the polysilicon feature; and
a plurality of electrodes embedded in the polysilicon feature, wherein one of the plurality of electrodes has an edge facing the sidewall spacer, and wherein a portion of the polysilicon feature continuously extends from the edge of the one of the plurality of electrodes to the sidewall spacer;
a first gate stack of a n-type field-effect transistor (nFET) formed on the semiconductor substrate, the first gate stack including:
a first portion of a high k dielectric layer;
a first metal layer having a first work function on the first portion of the high k dielectric layer; and
a first conductive layer on the first metal layer; and
a second gate stack of a p-type FET (pFET), the second gate stack including:
a second portion of the high k dielectric layer;
a second metal layer having a second work function on the second portion of the high k dielectric layer; and
a second conductive layer on the second metal layer,
wherein the second work function is greater than the first work function.
9. The integrated circuit of claim 8 , wherein the plurality of electrodes comprises:
one of the first metal layer and the second metal layer; and
one of the first conductive layer and the second conductive layer.
10. The integrated circuit of claim 8 , wherein the first metal layer include tantalum and the second metal layer includes titanium nitride.
11. The integrated circuit of claim 8 , wherein each of the first and second conductive layers each comprises one of aluminum and tungsten.
12. An integrated circuit, comprising:
a semiconductor substrate; and
a passive polysilicon device disposed over the semiconductor substrate, the passive polysilicon device including:
a polysilicon feature;
a sidewall spacer disposed along a sidewall of the polysilicon feature; and
a plurality of electrodes fully embedded in the polysilicon feature, wherein at least one of the plurality of electrodes includes a first feature of a first conductive material and a second feature of a second conductive material, the first feature formed on the second feature and the first conductive material being different than the second conductive material, wherein the second feature has an edge facing the sidewall spacer, and wherein a portion of the polysilicon feature continuously extends from the edge of the second feature to the sidewall spacer.
13. The integrated circuit of claim 12 , wherein the passive polysilicon device further comprises:
a conductive layer formed over the semiconductor substrate and formed of a third conductive material,
wherein the polysilicon feature is formed on the conductive layer and formed of a polysilicon material, the polysilicon material being different than the third conductive material.
14. The integrated circuit of claim 13 , wherein the passive polysilicon device further comprises a high k dielectric layer interposed between the semiconductor substrate and the conductive layer.
15. The integrated circuit of claim 12 , further comprising
a high k dielectric layer interposed between the semiconductor substrate and the passive polysilicon device;
a first gate stack of a n-type field-effect transistor (nFET) formed on the semiconductor substrate, the first gate stack including:
a first portion of the high k dielectric layer;
a first metal material having a first work function on the first portion of the high k dielectric layer; and
a third conductive material on the first metal material; and
a second gate stack of a p-type FET (pFET), the second gate stack including:
a second portion of the high k dielectric layer;
a second metal material having a second work function on the second portion of the high k dielectric layer; and
a fourth conductive material on the second metal material,
wherein the second work function is greater than the first work function.
16. The integrated circuit of claim 15 , wherein the first conductive material is the same as the third conductive material and the second conductive material is the same as the first metal material.
17. The integrated circuit of claim 15 , wherein the first conductive material is the same as the fourth conductive material and the second conductive material is the same as the second metal material.
18. The integrated circuit of claim 12 , wherein the passive polysilicon device is disposed over a shallow trench isolation (STI) disposed in the semiconductor substrate.
19. The integrated circuit of claim 12 , wherein the polysilicon feature has a top surface and opposing bottom surface such that the at least one of the plurality of electrodes extends from the top surface to the bottom surface of the polysilicon feature.
20. The integrated circuit of claim 12 , wherein the polysilicon feature is formed of a polysilicon material, the polysilicon material being different than the first conductive material and the second conductive material.
21. The integrated circuit of claim 12 , wherein the passive polysilicon device includes a conductive layer formed over the semiconductor substrate, wherein the at least one of the plurality of electrodes physically contacts the conductive layer.