IP Library Granted Patent US 8,896,745
Granted Patent B2
US 8,896,745 · App. 13/551,912 · Granted Nov 25, 2014

Image pickup apparatus and camera module

Inventor: Taizo Takachi (Kanagawa, JP)
Assignee: Sony Corporation
H01L27/14618H01L27/14685H01L27/14625H04N5/3572H04N5/2257
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Quick Facts
Patent No.
US 8,896,745
App. No.
13/551,912
Granted
Nov 25, 2014
Kind
B2
Abstract

An image pickup apparatus includes an optical sensor including a light receiving unit, a sealing material configured to protect the optical sensor on a side of the light receiving unit, an intermediate layer formed at least between the light receiving unit and a first surface of the sealing material, the first surface being an opposed surface to the light receiving unit, and a control film configured to cause a cutoff wavelength to shift to a short wave side in accordance with an incident angle of light that is incident thereon obliquely, in which the control film includes a first control film formed on the first surface of the sealing material, the first surface being the opposed surface to the light receiving unit, and a second control film formed on a second surface of the sealing material, the second surface being opposite to the first surface.

Claims (33)

1. An image pickup apparatus, comprising:

an optical sensor including a light receiving unit;

a sealing material configured to protect the optical sensor on a side of the light receiving unit;

an intermediate layer formed at least between the light receiving unit and a first surface of the sealing material, the first surface being an opposed surface to the light receiving unit; and

a control film configured to cause a cutoff wavelength to shift to a short wave side in accordance with an incident angle of light that is incident thereon obliquely, wherein

the shift of the cutoff frequency satisfies the following condition:

λ CF (θ)=λ CF (0)*cos(θ)

where θ represents the incident angle, λCF(θ) represents the cutoff wavelength of the incident angle θ, and λCF(0) represents the cutoff wavelength of the incident angle 0 degrees, and

the control film includes a first control film that is a multilayer film formed on the first surface of the sealing material, the first surface being the opposed surface to the light receiving unit, and a second control film formed on a second surface of the sealing material, the second surface being opposite to the first surface.

2. The image pickup apparatus according to claim 1 , wherein

the first control film includes a function as an infrared cut filter configured to cut off light in an infrared region.

3. The image pickup apparatus according to claim 1 , wherein

the control film is formed of a multilayer film of a plurality of films, refractive indexes of which are different, and

the first control film and the second control film are formed by sorting the number of films so that a stress of a warp is balanced.

4. The image pickup apparatus according to claim 3 , wherein

the multilayer film is obtained by disposing two or more kinds of film materials with a film material having a high refractive index and a film material having a low refractive index being alternated in a stated order.

5. A camera module, comprising:

an optical sensor including a light receiving unit;

a sealing material configured to protect the optical sensor on a side of the light receiving unit;

an intermediate layer formed at least between the light receiving unit and a first surface of the sealing material, the first surface being an opposed surface to the light receiving unit;

a control film configured to cause a cutoff wavelength to shift to a short wave side in accordance with an incident angle of light that is incident thereon obliquely; and

a lens configured to form a subject image on the light receiving unit of the optical sensor, wherein

the shift of the cutoff frequency satisfies the following condition:

λ CF (θ)=λ CF (0)*cos(θ)

where θ represents the incident angle, λCF(θ) represents the cutoff wavelength of the incident angle θ, and λCF(0) represents the cutoff wavelength of the incident angle 0 degrees, and

the control film includes a first control film that is a multilayer film formed on the first surface of the sealing material, the first surface being the opposed surface to the light receiving unit, and a second control film formed on a second surface of the sealing material, the second surface being opposite to the first surface.

6. The camera module according to claim 5 , wherein

the first control film includes a function as an infrared cut filter configured to cut off light in an infrared region.

7. The camera module according to claim 5 , wherein

the control film is formed of a multilayer film of a plurality of films, refractive indexes of which are different, and

the first control film and the second control film are formed by sorting the number of films so that a stress of a warp is balanced.

8. The camera module according to claim 7 , wherein

the multilayer film is obtained by disposing two or more kinds of film materials with a film material having a high refractive index and a film material having a low refractive index being alternated in a stated order.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 18, 2012
From: TAKACHI, TAIZO
To: SONY CORPORATION
Reel/Frame 028577/0253 →
Priority Claims (1)
JP 2011-177136 · Aug 12, 2011 · national
Continuity (1)
Related Publication 20130038764A1 · Feb 14, 2013