Sputtering device with gas injection assembly

1. A sputtering device, comprising:

a chamber; and

a substrate transferring unit for loading a substrate into, or unloading the substrate from the chamber, the substrate transferring unit comprising a supporting unit for supporting the substrate, and a gas injection assembly mounted on the supporting unit and forming a gas cushion between the substrate and an upper surface of the substrate transferring unit,

wherein the gas injection assembly comprises:

a plurality of nozzle groups including a plurality of gas injection nozzles, the gas injection nozzles including an injection opening and a plurality of inlets arranged around the injection opening;

gas flow amount controllers spaced from the gas injection nozzles with a certain interval; and

at least one distance detecting sensor attached to a front surface of the gas injection assembly and provided at each of the nozzle groups, respectively, to individually measure a corresponding distance between the substrate and corresponding gas injection nozzles,

wherein a height of the gas cushion is controlled based upon the measured distance and the gas flow amount controllers.

2. The sputtering device of claim 1 , wherein the gas injection unit injects gas onto the upper surface of the supporting unit when loading the substrate on the substrate transferring unit, when loading/unloading the substrate transferring unit with the substrate into/from the chamber of the sputtering device, and when coating the thin film on the substrate.

3. The device of claim 1 , wherein the gas injection assembly individually controls a gas injection amount by detecting a distance between the substrate and the gas injection nozzles of the corresponding nozzle group.

4. The device of claim 1 , wherein the substrate transferring unit further comprises a fixing unit for fixing only a lower side of the substrate to the supporting unit and a roller for moving the substrate transferring unit.

5. The device of claim 3 , wherein

the substrate transferring unit is inclined by an angle with respect to a vertical direction when loading/unloading the substrate into/from the chamber, and when depositing a thin film on the substrate.

6. The device of claim 1 , wherein the at least one nozzle group individually controls a gas flow amount inside the gas injection assembly by using a corresponding gas flow amount controller and a corresponding distance detecting sensor.

7. The device of claim 1 , wherein the gas injection nozzle has a circular cross-section.

8. The device of claim 1 , wherein the injection opening is positioned in a middle of the gas injection nozzle and the inlets are radially formed around the injection opening.

9. The device of claim 1 , wherein the injection opening has a gap between adjacent injection openings is about 10 mm or less.

10. The device of claim 1 , wherein the plurality of inlets includes:

a plurality of first inlets radially formed around the injection opening at a first distance from the injection opening; and

a plurality of second inlets radially formed around the injection opening at a second distance from the injection opening.

11. The device of claim 1 , wherein the plurality of inlets includes:

a first ring-shaped inlet surrounding the injection opening at a first distance from the injection opening; and

a second ring-shaped inlet surrounding the injection opening at a second distance from the injection opening.

12. The device of claim 1 , wherein the gas injection nozzle further includes:

a gas injection pipe connected to the injection opening for supplying gas to the substrate through the injection opening; and

a gas exhaustion pipe connected to the inlet for exhausting gas through the inlet.