Semiconductor device
A semiconductor device has a gate electrode including a leg part and a canopy part. A barrier layer is formed on a bottom face of the leg part of the gate electrode. In addition, on the lower surface of the barrier layer, a Schottky metal layer with an electrode width wider than the electrode width of the barrier layer is formed to have a Schottky junction with a semiconductor layer.
1. A semiconductor device, comprising:
a semiconductor layer;
a drain electrode and a source electrode formed in mutually separated positions on a surface of the semiconductor layer and respectively make ohmic contact with the semiconductor layer; and
a gate electrode comprising a leg part and a canopy part provided on top of the leg part and having a width wider than that of the leg part, the gate electrode further comprising a barrier layer formed on the bottom face of the leg part and a Schottky metal layer that is in contact with a lower surface of the barrier layer and forms a Schottky junction with the semiconductor layer,
wherein the Schottky metal layer that forms the Schottky junction is wider than the barrier layer formed on the bottom face of the leg part, and
the gate electrode is Y-shaped.
2. The semiconductor device according to claim 1 , wherein
the Schottky metal layer comprises titanium.
3. The semiconductor device according to claim 1 , wherein side surfaces of the gate electrode are curved.
4. The semiconductor device according to claim 3 , wherein the barrier layer is also formed on the curved side surfaces of the gate electrode, and the barrier layer has curved side surfaces.
5. The semiconductor device according to claim 4 , wherein the barrier layer covers the curved side surfaces of the gate electrode entirely.
6. The semiconductor device according to claim 5 , wherein the Schottky junction layer is also formed on the barrier layer that covers the curved side surfaces of the gate electrode, and the Schottky junction layer has curved side surfaces.
7. The semiconductor device according to claim 4 , wherein the Schottky junction layer covers the curved side surfaces of the barrier layer partially.
8. The semiconductor device according to claim 1 , wherein the semiconductor layer has a recess portion and the Schottky metal layer is formed on the recess portion.
9. The semiconductor device according to claim 8 , wherein the width of the canopy part is larger than the width of the recess portion.
10. A semiconductor device, comprising:
a semiconductor layer;
a drain electrode and a source electrode formed on a surface of the semiconductor layer; and
a gate electrode including a metal layer having curved side surfaces, an upper portion, and a bottom portion that is narrower than the top portion, a Schottky metal layer that forms a Schottky junction with the semiconductor layer, and a barrier layer formed between the Schottky metal layer and the bottom face of the bottom portion,
wherein the Schottky metal layer that forms the Schottky junction is wider than the barrier layer formed on the bottom face of the bottom portion, and
the gate electrode is Y-shaped.
11. The semiconductor device according to claim 10 , wherein the barrier layer is also formed on the curved side surfaces of the metal layer, and the barrier layer has curved side surfaces.
12. The semiconductor device according to claim 11 , wherein the barrier layer covers the curved side surfaces of the metal layer entirely.
13. The semiconductor device according to claim 12 , wherein the Schottky junction layer is also formed on the barrier layer that covers the curved side surfaces of the metal layer, and the Schottky junction layer has curved side surfaces.
14. The semiconductor device according to 11 , wherein the Schottky junction layer covers the curved side surfaces of the barrier layer partially.
15. The semiconductor device according to claim 10 , wherein the semiconductor layer has a recess portion and the Schottky metal layer is formed on the recess portion.
16. The semiconductor device according to claim 15 , wherein the width of the canopy part is larger than the width of the recess portion.
17. A method of manufacturing a semiconductor device, comprising:
forming a semiconductor layer on a semiconductor substrate;
forming drain and source electrodes on a surface of the semiconductor layer;
forming a recess portion on the semiconductor layer;
forming a Schottky metal layer that forms a Schottky junction with the semiconductor layer at the recess portion;
forming a barrier layer on the Schottky metal layer; and
forming a metal layer on the barrier layer,
wherein the Schottky metal layer that forms the Schottky junction is wider than the barrier layer formed on a bottom face of the metal layer, and
the Schottky metal layer, the barrier layer, and the metal layer form a Y-shaped electrode.
18. The method of claim 17 , wherein the Schottky metal layer, the barrier layer, and the metal layer are formed with curved side surfaces.
19. The method of claim 17 , wherein the barrier layer covers the curved side surfaces of the metal layer entirely.
20. The method of claim 17 , wherein the Schottky junction layer covers the curved side surfaces of the barrier layer partially.