Transition between a laminated PCB and a waveguide including a lamina with a printed conductive surface functioning as a waveguide-backshort

1. A system configured to direct electromagnetic millimeter-waves towards a waveguide using an electrically conductive formation within a Printed Circuit Board (PCB), comprising:

a waveguide having an aperture;

at least two laminas belonging to the PCB;

a first electrically conductive surface printed on one of the at least two laminas and located over the aperture, such that the first electrically conductive surface covers at least most of the aperture;

a plurality of Vertical Interconnect Access (VIA) holes filled or plated with an electrically conductive material, electrically connecting the first electrically conductive surface to the waveguide, thereby forming an electrically conductive cage over the aperture; and

a probe, printed on another one of the at least two laminas of the PCB, and said probe is located inside the cage and over the aperture;

the system configured to direct the millimeter-waves, transmitted by the probe, towards the waveguide;

wherein the thickness of the lamina carrying the first electrically conductive surface is operative to best position the first electrically conductive surface relative to the probe in order to optimize millimeter-wave energy propagation through the waveguide and towards an unsealed end of the waveguide at a frequency band between 20 GHz and 100 GHz.

2. The system of claim 1 , wherein the waveguide is a discrete waveguide attached to the PCB, and electrically connected to the electrically conductive cage.

3. The system of claim 1 , wherein the waveguide is a laminate waveguide structure within the PCB, comprising:

at least one additional lamina, belonging to the PCB, comprising a cavity shaped in the form of the aperture; and

an electrically conductive plating, applied on walls of the cavity;

the cavity is located below the electrically conductive cage.

4. The system of claim 3 , further comprising:

additional electrically conductive surfaces printed on the at least one additional lamina, the additional electrically conductive surfaces extending outwards from the cavity, and are electrically connected to the electrically conductive plating; wherein said plurality of VIA holes extending through the additional electrically conductive surfaces and around the electrically conductive plating.

5. The system of claim 4 , further comprising a ground layer or at least one ground trace associated with a signal trace, forming a transmission line for the millimeter-waves, reaching the probe; the at least one ground trace electrically connected to at least one of the additional electrically conductive surfaces, and the transmission line configured to carry the millimeter-wave from a source connected to one end of the transmission line to the probe.

6. The system of claim 5 , wherein the ground layer or at least one ground trace is connected to at least one of the additional electrically conductive surfaces through at least one of said plurality of VIA holes, or through at least one additional VIA hole.

7. The system of claim 5 , wherein the another lamina used to carry the probe on one side thereof, is the same lamina used to carry the at least one ground trace on the opposite side thereof, and the another lamina carrying the probe is made out of a soft laminate material suitable to be used as a millimeter-wave band substrate in PCB.

8. The system of claim 1 , wherein the aperture is dimensioned to result in a waveguide having a cutoff frequency above 20 GHz.

9. The system of claim 1 , wherein the first electrically conductive surface covers all of the aperture.