IP Library › Granted Patent US 8,913,348
Granted Patent B2
US 8,913,348 · App. 14/086,331 · Granted Dec 16, 2014

Suspension board with circuit

Inventors: Naotaka Higuchi (Osaka, JP); Hitoki Kanagawa (Osaka, JP); Tadashi Takahashi (Osaka, JP)
Assignee: Nitto Denko Corporation
G11B5/486G11B5/4873
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Quick Facts
Patent No.
US 8,913,348
App. No.
14/086,331
Granted
Dec 16, 2014
Kind
B2
Abstract

A suspension board with circuit includes a metal supporting layer, an insulating base layer formed on the metal supporting layer, a conductive layer formed on the insulating base layer, and a slider supported on the metal supporting layer via a pedestal. The conductive layer includes a conductive overlapping portion which overlaps a plane on which the slider is projected when projected in a thickness direction. The conductive overlapping portion is provided to be spaced apart from the slider.

Claims (53)

1. A suspension board with circuit, comprising:

a metal supporting layer;

an insulating base layer formed on the metal supporting layer;

a conductive layer formed on the insulating base layer; and

a slider supported on the metal supporting layer via a pedestal, wherein

the conductive layer includes a conductive overlapping portion which overlaps a plane on which the slider is projected when projected in a thickness direction, and

the conductive overlapping portion is provided to be spaced apart from the slider and extends along a first direction,

the pedestal includes a first pedestal and a second pedestal disposed opposite each other across the conductive overlapping portion, and

the first pedestal and the second pedestal extend along the first direction.

2. A suspension board with circuit according to claim 1 , further comprising:

an insulating cover layer formed on the insulating base layer so as to cover the conductive layer, wherein

the pedestal includes:

a pedestal base layer included in the insulating base layer;

a pedestal conductive layer included in the conductive layer and formed on the pedestal base layer; and

a pedestal cover layer included in the insulating cover layer and formed on the pedestal base layer so as to cover the pedestal conductive layer.

3. A suspension board with circuit according to claim 1 , further comprising:

a piezoelectric element electrically connected to the conductive layer, wherein

the metal supporting layer is configured to cause the slider to operate in association with the piezoelectric element based on extension/contraction thereof.

4. A suspension board with circuit according to claim 3 , wherein

a plurality of the piezoelectric elements are provided to be spaced apart from each other such that the slider is interposed therebetween when projected in the thickness direction,

the conductive layer includes a wire connecting the plurality of piezoelectric elements, and

the wire includes the conductive overlapping portion.

5. A suspension board with circuit according to claim 1 , wherein

the conductive layer includes a terminal electrically connected to a piezoelectric element, and

the terminal and the pedestal are arranged to be spaced apart from each other.

6. A suspension board with circuit according to claim 1 , wherein

the insulating base layer includes a base overlapping portion which overlaps the plane on which the slider is projected when projected in the thickness direction to support the conductive overlapping portion, and

the base overlapping portion is formed to have a thickness smaller than a thickness of the portion of the insulating base layer other than the base overlapping portion.

7. A suspension board with circuit according to claim 1 , wherein

the metal supporting layer includes a support overlapping portion which overlaps the plane on which the slider is projected when projected in the thickness direction to support the conductive overlapping portion, and

the support overlapping portion is formed to have a thickness smaller than a thickness of the portion of the metal supporting layer other than the support overlapping portion.

8. A suspension board with circuit according to claim 2 , wherein a thickness of the pedestal cover layer is greater than 40μm and less than or equal to 80μm.

9. A suspension board with circuit, comprising:

a metal supporting layer;

an insulating base layer formed on the metal supporting layer;

a conductive layer formed on the insulating base layer; and

a slider supported on the metal supporting layer via a pedestal, wherein

the conductive layer includes a conductive overlapping portion which overlaps a plane on which the slider is projected when projected in a thickness direction, and

the conductive overlapping portion is provided to be spaced apart from the slider; further comprising:

a plurality of piezoelectric elements electrically connected to the conductive layer, wherein

the metal supporting layer is configured to cause the slider to operate in association with the plurality of piezoelectric elements based on extension/contraction thereof, wherein

the plurality of the piezoelectric elements are provided to be spaced apart from each other such that the slider is interposed therebetween when projected in the thickness direction,

the conductive layer includes a wire connecting the plurality of piezoelectric elements, and

the wire includes the conductive overlapping portion.

10. A suspension board with circuit, comprising:

a metal supporting layer;

an insulating base layer formed on the metal supporting layer;

a conductive layer formed on the insulating base layer; and

a slider supported on the metal supporting layer via a pedestal,

wherein the conductive layer includes a conductive overlapping portion which overlaps a plane on which the slider is projected when projected in a thickness direction,

wherein the conductive overlapping portion is provided to be spaced apart from the slider,

wherein the metal supporting layer includes a support overlapping portion which overlaps the plane on which the slider is projected when projected in the thickness direction to support the conductive overlapping portion, and

wherein the support overlapping portion is formed to have a thickness smaller than a thickness of the portion of the metal supporting layer other than the support overlapping portion.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Dec 16, 2013
From: HIGUCHI, NAOTAKA; KANAGAWA, HITOKI; TAKAHASHI, TADASHI
To: NITTO DENKO CORPORATION
Reel/Frame 031791/0032 →
Priority Claims (1)
JP 2012-270507 · Dec 11, 2012 · national
Continuity (1)
Related Publication 20140160599A1 · Jun 12, 2014