Semiconductor device and method for fabricating a semiconductor device
A semiconductor device is disclosed. In one embodiment, the semiconductor device includes two different semiconductor materials. The two semiconductor materials are arranged adjacent one another in a common plane.
1. A semiconductor device, comprising:
a body comprising:
a first portion comprising a first semiconductor material having a first bandgap;
a second portion comprising a second semiconductor material having a second bandgap, the second bandgap being different from the first bandap; and
the first portion and the second portion being coplanar and dielectrically insulated from one another; and
wherein the body is disposed on a substrate with the first and second portions being laterally adjacent to one another on the substrate, wherein the substrate includes a first region and a second region laterally adjacent to one another, the first region below the first portion and comprising a first substrate material, and the second region below the second portion and comprising a second substrate material which is different from the first substrate material.
2. The semiconductor device according to claim 1 , wherein the first portion comprises a HEMT structure.
3. The semiconductor device according to claim 1 , wherein the second portion comprises a CMOS device.
4. The semiconductor device according to claim 1 , wherein the first portion comprises a III-V semiconductor material.
5. The semiconductor device according to claim 1 , wherein the first portion comprises a GaN layer, an AlGaN layer arranged on the GaN layer and a gate electrode positioned on the AlGaN layer.
6. The semiconductor device according to claim 1 , wherein the second portion comprises <100> silicon.
7. The semiconductor device according to claim 1 , further comprising a dielectric barrie arranged in an interface between the first portion and the second portion.
8. The semiconductor device according to claim 1 , further comprising a <111> silicon layer positioned adjacent the second portion.
9. The semiconductor device according to claim 8 , further comprising a dielectric positioned adjacent the first portion.
10. The semiconductor device according to claim 1 , further comprising a dielectric layer positioned adjacent the first portion and the second portion.
11. The semiconductor device according to claim 1 , wherein the second portion comprises <100> silicon, a <111> silicon layer is positioned adjacent the second portion and an oxide layer is arranged between the <111> silicon and the <100> silicon.
12. The semiconductor device according to claim 1 , further comprising a re-wiring structure.
13. The semiconductor device of claim 1 , wherein the first substrate material comprises an insulating material, such as an oxide, and the second substrate material comprises a silicon material.