Semiconductor light-detecting element
Prepared is an n − type semiconductor substrate 1 having a first principal surface 1 a and a second principal surface 1 b opposed to each other, and having a p + type semiconductor region 3 formed on the first principal surface 1 a side. At least a region opposed to the p + type semiconductor region 3 in the second principal surface 1 b of the n − type semiconductor substrate 1 is irradiated with a pulsed laser beam to form an irregular asperity 10 . After formation of the irregular asperity 10 , an accumulation layer 11 with an impurity concentration higher than that of the n − type semiconductor substrate 1 is formed on the second principal surface 1 b side of the n type semiconductor substrate 1 . After formation of the accumulation layer 11 , the n − type semiconductor substrate 1 is subjected to a thermal treatment.
1. A semiconductor light-detecting element comprising:
a silicon substrate having a principle surface and having a pn junction comprised of a semiconductor region of a first conductivity type and a semiconductor region of a second conductivity type,
wherein on the silicon substrate, an accumulation layer of the first conductivity type is formed on a principal surface side of the silicon substrate and an irregular asperity is formed in at least a region opposed to the pn junction in the principal surface,
wherein the region opposed to the pn junction in the principal surface of the silicon substrate is optically exposed, and
wherein a surface opposed to the principal surface where the irregular asperity is formed constitutes a light incident surface, light incident from the light incident surface travels in the silicon substrate, the semiconductor light-detecting element being a front-illuminated type.
2. The semiconductor light-detecting element according to claim 1 , wherein a thickness of the accumulation layer of the first conductivity type is larger than a height difference of the irregular asperity.
3. The semiconductor light-detecting element according to claim 1 , wherein the light incident from the light incident surface and traveling in the silicon substrate is reflected, scattered, or diffused by the irregular asperity.
4. The semiconductor light-detecting element according to claim 1 , wherein no electrode is formed on the region opposed to the pn junction in the principal surface of the silicon substrate.