Film formation apparatus, film formation method, manufacturing apparatus, and method for manufacturing light-emitting device
An object is to improve use efficiency of an evaporation material, to reduce manufacturing cost of a light-emitting device, and to reduce manufacturing time needed for a light-emitting device including a layer containing an organic compound. The pressure of a film formation chamber is reduced, a plate is rapidly heated by heat conduction or heat radiation by using a heat source, a material layer on a plate is vaporized in a short time to be evaporated to a substrate on which the material layer is to be formed (formation substrate), and then the material layer is formed on the formation substrate. The area of the plate that is heated rapidly is set to have the same size as the formation substrate and film formation on the formation substrate is completed by one application of heat.
1. A film formation apparatus comprising:
a film formation chamber;
a heat source provided in the film formation chamber;
a first supporting unit to hold a first substrate over the heat source;
a shutter provided between the heat source and the first substrate; and
a second supporting unit to hold a second substrate over the first supporting unit,
wherein the heat source is a lamp,
wherein the lamp is capable of moving to adjust a heating temperature, and
wherein the second supporting unit is capable of moving to adjust a distance between the first substrate and the second substrate.
2. The film formation apparatus according to claim 1 , further comprising a vacuum evacuation treatment chamber to evacuate the film formation chamber.
3. The film formation apparatus according to claim 1 , further comprising a cooling unit to cool the second substrate.
4. The film formation apparatus according to claim 1 , further comprising a heating unit to heat the second substrate.
5. The film formation apparatus according to claim 1 , further comprising an alignment unit to adjust a position of a mask and the second substrate in the film formation chamber.
6. The film formation apparatus according to claim 1 , further comprising a sensor to measure humidity in the film formation chamber.
7. The film formation apparatus according to claim 1 , wherein the distance between the first substrate and the second substrate is more than or equal to 0.5 mm and less than or equal to 5 mm.
8. The film formation apparatus according to claim 1 , wherein the shutter is capable of insulating heat from the heat source to the first substrate.
9. A manufacturing apparatus comprising:
a load chamber;
a first film formation chamber connected to the load chamber;
a transfer chamber connected to the first film formation chamber;
a second film formation chamber connected to the transfer chamber;
an unload chamber connected to the second film formation chamber,
a coating device provided in the first film formation chamber;
a heat source provided in the second film formation chamber;
a first supporting unit to hold a first substrate over the heat source;
a shutter provided between the heat source and the first substrate; and
a second supporting unit to hold a second substrate, disposed to face the first supporting unit,
wherein the first substrate is introduced from the load chamber to the first film formation chamber,
wherein a layer containing a material is coated onto the first substrate in the first film formation chamber,
wherein the first substrate is introduced from the first film formation chamber to the second film formation chamber through the transfer chamber,
wherein the first substrate is disposed in the second film formation chamber, the first substrate facing the second substrate,
wherein the layer is formed on a surface of the second substrate disposed to face the first substrate, and
wherein the second substrate provided with the layer is transferred to the unload chamber
wherein the heat source is a lamp,
wherein the lamp is capable of moving to adjust a heating temperature, and
wherein the second supporting unit is capable of moving to adjust a distance between the first substrate and the second substrate.
10. The manufacturing apparatus according to claim 9 , further comprising a vacuum evacuation treatment chamber to evacuate the second film formation chamber.
11. The manufacturing apparatus according to claim 9 , further comprising a cooling unit to cool the second substrate.
12. The manufacturing apparatus according to claim 9 , further comprising a heating unit to heat the second substrate.
13. The manufacturing apparatus according to claim 9 , further comprising an alignment unit to adjust a position of a mask and the second substrate in the second film formation chamber.
14. The manufacturing apparatus according to claim 9 , further comprising a sensor to measure humidity in the second film formation chamber.
15. The manufacturing apparatus according to claim 9 , wherein the distance between the first substrate and the second substrate is more than or equal to 0.5 mm and less than or equal to 5 mm.
16. The manufacturing apparatus according to claim 9 , wherein the shutter is capable of insulating heat from the heat source to the first substrate.