IP Library › Granted Patent US 8,920,927
Granted Patent B2
US 8,920,927 · App. 13/183,411 · Granted Dec 30, 2014

Resin particle and resin dispersion

Inventors: Takao Mukai (Kyoto, JP); Tsuyoshi Izumi (Kyoto, JP); Natsuki Nakamichi (Kyoto, JP)
Assignee: Sanyo Chemical Industries, Ltd
C08J3/126C08L31/04C08K5/098C08K5/42C08K5/51C08L75/04
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Quick Facts
Patent No.
US 8,920,927
App. No.
13/183,411
Granted
Dec 30, 2014
Kind
B2
Abstract

Resin particles which are excellent in electrostatic property, thermal storage stability and thermal properties, and have evenness of particle diameter are to be provided. The resin particles are core-shell resin particles (C2) each comprising one or more film-like shell layers (P) comprising a first resin (a) and a core layer (Q) comprising a second resin (b). Core-shell type resin particles (C2) each comprising a film-like shell layer (P) in one or more layer structure comprising a first resin (a) and a core layer (Q) in one layer structure comprising a second resin (b), wherein the weight ratio of (P) and (Q) is in a range of (0.1:99.9) to (70:30), the content of volatile components of (C2) is 2% by weight or lower, and (a) has an initial softening temperature of 40 to 270° C., a glass transition temperature of 20 to 250° C., a flow temperature of 60 to 300° C., and the difference of the glass transition temperature and the flow temperature in a range of 0 to 120° C. and contains 20 to 80% by weight of vinyl acetate as constituent units.

Claims (5)

1. A water-based dispersion (X1) of resin particles (C1) comprising resin particles (B) bearing resin particles (A) on the surface thereof and obtained by mixing a water-based dispersion (W) of the resin particles (A) comprising a first resin (a) with a second resin (b) or its solvent solution, alternatively a precursor (b0) of the resin (b) or its solvent solution and dispersing the resin (b) or its solvent solution, alternatively the precursor (b0) of the resin (b) or its solvent solution, further causing a reaction of (b0) in the case of using (b0) or its solvent solution, in the water-based dispersion (W); and thereby forming the resin particles (B) comprising (b) in the water-based dispersion (W) of (A), wherein resin (a) contains a constituent unit of the following organic acid metal salt (m), and/or (A) contains the following organic acid metal salt (m), and wherein resin (a) contains 20 to 80% by weight of vinyl acetate as constituent units, and resin (a) does not comprise a polyurethane resin, and is either thermoplastic resin or thermosetting resin, and wherein the resin (b) comprises a polyurethane resin:

organic acid metal salt (m): one or more kinds of salts selected from carboxylic acid salts, sulfonic acid salts, and phosphoric acid salts of a metal selected from Ti, Cr, Mn, Fe, Zn, Ba, and Zr.

2. A water-based dispersion (X2) of resin particles (C21) obtained by forming a shell layer (P) in the form of a film made of (A) on the surface of a core layer (Q) containing (B) by dissolving (A) adhering to (B) in the solvent and/or melting (A) adhering to (B) in the water-based resin dispersion according to claim 1 .

3. Resin particles obtained by removing the water-based solvent from the water-based resin dispersion according to claim 1 .

4. Resin particles obtained by removing the water-based solvent from the water based resin dispersion (X2) of claim 2 .

Priority Claims (2)
JP 2005-110370 · Apr 6, 2005 · national
JP 2005-222147 · Jul 29, 2005 · national
Continuity (2)
Division 11918022
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