Circuit structure having islands between source and drain
A circuit structure includes a substrate, an unintentionally doped gallium nitride (UID GaN) layer over the substrate, a donor-supply layer over the UID GaN layer, a gate structure, a drain, and a source over the donor-supply layer. A number of islands are over the donor-supply layer between the gate structure and the drain. The gate structure disposed between the drain and the source. The gate structure is adjoins at least a portion of one of the islands and/or partially disposed over at least a portion of at least one of the islands.
1. A circuit structure comprising:
a substrate;
a bulk layer, over the substrate, comprising gallium nitride;
a donor-supply layer over the bulk layer;
a gate structure, a drain, and a source over the donor-supply layer, said gate structure disposed between the drain and the source;
a plurality of islands over the donor-supply layer between the gate structure and the drain;
wherein the gate structure is partially over at least a portion of at least one of the plurality of islands, and a largest island of the plurality of islands is partially disposed under the gate structure.
2. The circuit structure of claim 1 , wherein the plurality of islands is a plurality of p-type doped islands.
3. The circuit structure of claim 2 , wherein the plurality of p-type doped islands comprise gallium nitride, aluminum gallium nitride, nickel oxide, or zinc oxide.
4. The circuit structure of claim 3 , wherein the p-type dopant in the plurality of p-type doped islands comprises at least one of carbon, iron, magnesium, calcium, beryllium, and zinc.
5. The circuit structure of claim 4 , wherein a p-type dopant concentration is about 1E15 to 1E17/cm 3 .
6. The circuit structure of claim 1 , wherein the plurality of islands comprise a plurality of Schottky materials.
7. The circuit structure of claim 6 , wherein the Schottky materials comprise titanium, titanium nitride, titanium tungsten, or tungsten.
8. The circuit structure of claim 1 , wherein one or more of the plurality of islands are quadrilaterals in a top view.
9. The circuit structure of claim 1 , the plurality of islands and a portion of the donor-supply layer not covered by the plurality of islands form a checkered pattern.
10. The circuit structure of claim 1 , wherein the plurality of islands cover about 40% to about 75% of the portion of the donor-supply layer between the gate structure and the drain.
11. The circuit structure of claim 1 , wherein the donor-supply layer comprises undoped aluminum nitride or undoped aluminum gallium nitride.
12. The circuit structure of claim 1 , wherein a thickness of one or more of the plurality of islands is about 3 nanometer to about 100 nanometers.
13. A circuit structure comprising:
a substrate;
a III-V compound semiconductors layer over the substrate;
a donor-supply layer over the III-V compound semiconductors layer;
a plurality of p-type doped islands over a drift portion of the donor-supply layer;
a gate structure adjoining at least a side surface of one of the plurality of p-type doped islands at an edge of the drift portion, with a proviso that the gate structure does not overlap a top surface of any of the plurality of p-type doped islands;
a drain over the donor-supply layer at an opposite edge of the drift portion from the gate structure, the drain being isolated from the plurality of p-type doped islands; and
a source over the donor-supply layer, the gate structure being positioned between the source and the drain;
wherein a drift region of the donor-supply layer occupies at least 50% of the donor-supply layer.
14. The circuit structure of claim 13 , wherein the III-V compound semiconductor comprises gallium nitride, and the donor-supply layer comprises Al x Ga (1-x) N, wherein x is between 0 and 1.
15. The circuit structure of claim 13 , wherein the plurality of p-type doped islands comprise gallium nitride, aluminum gallium nitride, nickel oxide, or zinc oxide.
16. The circuit structure of claim 15 , wherein a p-type dopant in the plurality of p-type doped islands comprises at least one of carbon, iron, magnesium, calcium, beryllium, and zinc.
17. The circuit structure of claim 13 , wherein the substrate comprises silicon, silicon carbide, or sapphire.
18. The circuit structure of claim 13 , wherein the plurality of p-type doped islands cover about 40% to about 75% of the drift portion of the donor-supply layer.
19. The circuit structure of claim 13 , wherein a width ratio of the p-type doped island and an adjacent portion of the drift portion without an p-type doped island thereon is about 1:1.