Phase change memory and method of fabricating same

1. A method of fabricating a phase change memory (“PCM”) device comprising an interlayer dielectric (“ILD”) layer having electrodes disposed at opposite ends thereof, the method comprising:

defining a first area on a top surface of the ILD layer using a hard mask;

creating a spacer along an inner edge of the hard mask layer and an outer edge of the first area to define a second area;

depositing a phase change material layer within the second area;

depositing a protection layer over the phase change material layer;

isolating the phase change material layer; and

depositing a capping layer over the device.

2. The method of claim 1 wherein the defining comprises:

depositing at least one layer comprising the hard mask on the ILD layer; and

etching the hard mask to create the first area, wherein the at least one layer comprising the hard mask comprises an outer boundary of the first area.

3. The method of claim 2 wherein the depositing at least one layer comprising the hard mask comprises depositing at least one of an SiN layer, an oxide layer, and an SiON layer over the ILD layer, such that a total thickness of the hard mask layer is in a range of approximately 500 {acute over (Å)}-2000 {acute over (Å)}.

4. The method of claim 2 wherein the depositing at least one layer comprising the hard mask comprises:

depositing an SiN layer on the ILD layer, the SiN layer having a thickness of approximately 100 {acute over (Å)}-500 {acute over (Å)};

depositing an oxide layer on the SiN layer, the oxide layer having a thickness of approximately 100 {acute over (Å)}-500 {acute over (Å)}; and

depositing an SiON layer on the oxide layer, the SiON layer having a thickness of approximately 200 {acute over (Å)}-500 {acute over (Å)}.

5. The method of claim 1 wherein the creating a spacer comprises:

depositing a spacer layer; and

etching the spacer layer to create the spacer.

6. The method of claim 5 wherein the spacer comprises one of SiN, SiO2, and SiON and has a thickness of approximately 100 {acute over (Å)}-500 {acute over (Å)}.

7. The method of claim 1 wherein the isolating the phase change material layer comprises performing a chemical mechanical polish (“CMP”) process on a top surface of the device, the method further comprising stopping the CMP process at a designated layer of the hard mask.

8. The method of claim 1 wherein the depositing a protection layer comprises depositing a layer of SiN or SiO2 having a thickness of approximately 200 {acute over (Å)}-500 {acute over (Å)}.

9. The method of claim 1 wherein the depositing a capping layer comprises depositing a layer of SiN having a thickness of approximately 400 {acute over (Å)}-1000 {acute over (Å)}.

10. A method of fabricating a phase change memory (“PCM”) device comprising an interlayer dielectric (“ILD”) layer having electrodes disposed at opposite ends thereof, the method comprising:

defining a first rectangular area on a top surface of the ILD layer using a hard mask, the defining comprising:

depositing at least one layer comprising the hard mask on the ILD layer; and

etching the hard mask to create the first rectangular area, wherein the at least one layer comprising the hard mask comprises an outer boundary of the first rectangular area;

creating a spacer along an inner edge of the hard mask layer and an outer edge of the first rectangular area to define a second rectangular area, the creating comprising:

depositing a spacer layer; and

etching the spacer layer to create the spacer;

depositing a phase change material layer within the second rectangular area;

depositing a protection layer over the phase change material layer;

performing a CMP process on a top surface of the device to isolate the phase change material layer, the method further comprising stopping the CMP process at a designated layer of the hard mask; and

depositing a capping layer over the device.

11. The method of claim 10 wherein the depositing at least one layer comprising the hardmask comprises:

depositing an SiN layer on the ILD layer, the SiN layer having a thickness of approximately 3×102 {acute over (Å)};

depositing an oxide layer on the SiN layer, the oxide layer having a thickness of approximately 2×102 {acute over (Å)}; and

depositing an SiON layer on the oxide layer, the SiON layer having a thickness of approximately 4×102 {acute over (Å)};

wherein the designated layer is the SiN layer.

12. The method of claim 10 wherein the spacer comprises one of SiN, SiO2, and SiON and has a thickness of approximately 100 {acute over (Å)}-500 {acute over (Å)}.

13. A method of fabricating a phase change memory device comprising an interlayer dielectric (“ILD”) layer having electrodes disposed at opposite ends thereof, the method comprising:

forming a spacer to define a reaction area;

disposing a phase change material (PCM) layer within the reaction area;

disposing a protection layer over the PCM layer and within the reaction area defined by the spacer; and

disposing a capping layer over the protection layer and the spacer.

14. The method of claim 13 further comprising

forming an electrode underneath one end of the reaction area.

15. The method of claim 13 further comprising

forming a stop layer along an outer edge of the spacer.

16. The method of claim 13 wherein the spacer comprises at least one of SiN, SiO2, and SiON and has a thickness in a range of approximately 100 {acute over (Å)}-500 {acute over (Å)}.

17. The method of claim 13 wherein the phase change material comprises a GeSbTe alloy film.

18. The method of claim 13 wherein the protection layer comprises one of SiN and SiO2 and has a thickness in a range of 200 {acute over (Å)}-500 {acute over (Å)}.

19. The method of claim 13 wherein the capping layer comprises SiN and has a thickness in a range of 400 {acute over (Å)}-1000 {acute over (Å)}.

20. The method of claim 14 further comprising

forming a conductor below and in contact with the electrode.