IP Library › Granted Patent US 8,934,263
Granted Patent B2
US 8,934,263 · App. 13/195,806 · Granted Jan 13, 2015

Protective cover for pressure sensor assemblies

Inventors: Todd Eckhardt (Westerville, OH); Jim Machir (Columbus, OH); Palani Thanigachalam (Bangalore, IN); Sunil Job (Thiruvananthapuram, IN)
Assignee: Honeywell International Inc.
G01L9/00H01R12/585H01R12/523H05K1/144H05K2201/042H05K2201/10151H05K2201/1059H05K2201/10303H01R13/64
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,934,263
App. No.
13/195,806
Granted
Jan 13, 2015
Kind
B2
Abstract

The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a cover for use with a sensor assembly may include an electrically insulating body having perimeter features extending a majority of the way around perimeters of upper and lower printed circuit boards that the cover may vertically separate. In one example, the body of the cover may include support features that extend from a lower side of the cover and those support features may contact the lower printed circuit board in at least two locations. The support features of the cover may be separated by a gap and a sensor connected to the lower printed circuit board may be situated within the gap.

Claims (14)

1. A cover for a sensor sub-assembly, wherein the sensor sub-assembly includes a first printed circuit board that carries a sensor, the cover comprising:

an electrically insulating body;

the electrically insulating body including a first support feature that extends across at least a majority of the first printed circuit board, a second support feature that extends across at least a majority of the first printed circuit board, and a perimeter support feature that is positioned adjacent to a perimeter of the first printed circuit board, wherein at least part of the second support feature is spaced from the first support feature by a gap, wherein the sensor is situated in the gap, and wherein at least part of the first support feature is inwardly spaced from the perimeter support feature and has a side wall that faces outward toward the perimeter support feature;

the electrically insulating body further including one or more vents that allow air to flow to the sensor, wherein one or more of the vents extend through one or more of the first support feature, the second support feature, and the perimeter support feature; and

one or more electrical terminals supported by the electrically insulating body that convey one or more electrical signals to and/or from the first printed circuit board.

2. The cover of claim 1 , wherein the first support feature contacts the first printed circuit board at two or more places, and the second support feature contacts the first printed circuit board at two or more places.

3. The cover of claim 1 , wherein the perimeter support feature extends around at least a majority of a perimeter of the first printed circuit board.

4. The cover of claim 1 , wherein the one or more electrical terminals include one or more compliant pins that are configured to extend into corresponding holes in the first printed circuit board.

5. The cover of claim 4 , wherein the electrically insulating body is further configured to engage a second printed circuit board situated vertically above the first printed circuit board, wherein the one or more electrical terminals include one or more compliant pins that are configured to extend into corresponding holes in the second printed circuit board.

6. The cover of claim 5 , wherein the one or more compliant pins are the only mechanism that mechanically secures the first printed circuit board to the second printed circuit board.

7. The cover of claim 1 , further comprising:

an alignment feature for aligning the cover with the first printed circuit board.

8. The cover of claim 1 , further comprising:

an alignment feature for aligning the cover with a parent sensor assembly.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 3, 2011
From: ECKHARDT, TODD; MACHIR, JIM; THANIGACHALAM, PALANI; JOB, SUNIL
To: HONEYWELL INTERNATIONAL INC.
Reel/Frame 027008/0524 →
Continuity (1)
Related Publication 20130033841A1 · Feb 7, 2013