IP Library Granted Patent US 8,946,903
Granted Patent B2
US 8,946,903 · App. 12/833,074 · Granted Feb 3, 2015

Electrically conductive laminate structure containing graphene region

Inventor: Gurtej S. Sandhu (Boise, ID)
Assignee: Micron Technology, Inc.
H01L21/76843H01L23/53238H01L23/53276H01L21/76805H01L21/76847H01L21/76865H01L21/76877
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Quick Facts
Patent No.
US 8,946,903
App. No.
12/833,074
Granted
Feb 3, 2015
Kind
B2
Abstract

Some embodiments include electrical interconnects. The interconnects may contain laminate structures having a graphene region sandwiched between non-graphene regions. In some embodiments the graphene and non-graphene regions may be nested within one another. In some embodiments an electrically insulative material may be over an upper surface of the laminate structure, and an opening may extend through the insulative material to a portion of the laminate structure. Electrically conductive material may be within the opening and in electrical contact with at least one of the non-graphene regions of the laminate structure. Some embodiments include methods of forming electrical interconnects in which non-graphene material and graphene are alternately formed within a trench to form nested non-graphene and graphene regions.

Claims (15)

1. An electrically conductive laminate structure comprising:

a first non-graphene layer configured as an upwardly-opening first container shape, the first non-graphene layer being electrically conductive and continuous along the first container shape;

at least one graphene monolayer within the first container shape and directly against the first non-graphene layer, the graphene monolayer being configured as an upwardly-opening second container shape; and

a second non-graphene layer within the second container shape and directly against the graphene monolayer, the second non-graphene layer being electrically insulative and continuous along the first container shape.

2. The laminate structure of claim 1 further comprising a plurality of graphene monolayers within the first container shape and directly against the first non-graphene layer.

3. The laminate structure of claim 1 further comprising from 2 to 5 graphene monolayers within the first container shape and directly against the first non-graphene layer.

4. The laminate structure of claim 1 wherein at least one of the non-graphene layers comprises one or more metals.

5. The laminate structure of claim 1 wherein at least one of the non-graphene layers comprises one or both of copper and nickel.

6. An electrically conductive laminate structure comprising:

a first non-graphene layer configured as an upwardly-opening first container shape, the first non-graphene layer being continuous along the first container shape;

a first graphene monolayer within the first container shape and directly against the first non-graphene layer, the first graphene monolayer being configured as an upwardly-opening second container shape;

a second non-graphene layer within the second container shape and directly against the first graphene monolayer; and

a second graphene monolayer within the first container shape and directly against the second non-graphene layer, the second graphene monolayer being configured as an upwardly-opening second container shape.

7. The laminate structure of claim 6 wherein both non-graphene layers are electrically conductive.

8. The laminate structure of claim 6 wherein both non-graphene layers are electrically insulative.

Assignments (8)
RELEASE OF SECURITY INTEREST Recorded Nov 12, 2019
From: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
Reel/Frame 051028/0001 →
RELEASE OF SECURITY INTEREST Recorded Oct 9, 2019
From: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 050937/0001 →
RELEASE OF SECURITY INTEREST Recorded Aug 23, 2018
From: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
To: MICRON TECHNOLOGY, INC.
Reel/Frame 047243/0001 →
SECURITY INTEREST Recorded Jul 13, 2018
From: MICRON TECHNOLOGY, INC.; MICRON SEMICONDUCTOR PRODUCTS, INC.
To: JPMORGAN CHASE BANK, N.A., AS COLLATERAL AGENT
Reel/Frame 047540/0001 →
CORRECTIVE ASSIGNMENT TO CORRECT THE REPLACE ERRONEOUSLY FILED PATENT #7358718 WITH THE CORRECT PATENT #7358178 PREVIOUSLY RECORDED ON REEL 038669 FRAME 0001. ASSIGNOR(S) HEREBY CONFIRMS THE SECURITY INTEREST. Recorded Jun 8, 2017
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 043079/0001 →
PATENT SECURITY AGREEMENT Recorded Jun 2, 2016
From: MICRON TECHNOLOGY, INC.
To: MORGAN STANLEY SENIOR FUNDING, INC., AS COLLATERAL AGENT
Reel/Frame 038954/0001 →
SECURITY INTEREST Recorded May 12, 2016
From: MICRON TECHNOLOGY, INC.
To: U.S. BANK NATIONAL ASSOCIATION, AS COLLATERAL AGENT
Reel/Frame 038669/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 9, 2010
From: SANDHU, GURTEJ S.
To: MICRON TECHNOLOGY, INC.
Reel/Frame 024657/0393 →
Continuity (1)
Related Publication 20120006580A1 · Jan 12, 2012