Heat pump device

1. A heat pump device for heating and cooling, comprising: a reversible heat pump, the reversible heat pump being arranged for transfer of thermal energy both from a first side of the heat pump to a second side of the heat pump and from the second side to the first side; a first heat exchanger arranged at the first side of the heat pump, the first heat exchanger being thermally connected to a first heat carrier being circulated in a first loop; a second heat exchanger arranged at the second side of the heat pump, the second heat exchanger being arranged to transfer thermal energy to or from a second heat carrier which is circulated in a second loop; a conduit that interconnects the first and the second loops so that the first loop, the second loop and the conduit together form a connected system; and one and the same heat carrier is arranged in the connected system, wherein the conduit is at least 50 cm long and the conduit has an inner diameter that is maximally 10 mm such that there is general pressure equalization and essentially no heat carrier flows from the first loop to the second loop, and the heat carrier can flow either way in the conduit.

2. A heat pump device for heating and cooling, comprising: a reversible heat pump, the reversible heat pump being arranged for transfer of thermal energy both from a first side of the heat pump to a second side of the heat pump and from the second side to the first side; a first heat exchanger arranged at the first side of the heat pump, the first heat exchanger being thermally connected to a first heat carrier being circulated in a first loop; a second heat exchanger arranged at the second side of the heat pump, the second heat exchanger being arranged to transfer thermal energy to or from a second heat carrier which is circulated in a second loop; a conduit that interconnects the first and the second loops so that the first loop, the second loop and the conduit together form a connected system; and one and the same heat carrier is arranged in the connected system, wherein the conduit has dimensions such that there is pressure equalization and essentially negligible flow of heat carrier fluid from the first loop to the second loop, and the heat carrier can flow either way in the conduit.

3. The heat pump device according to claim 1 , wherein the first heat exchanger has the same capacity as the second heat exchanger.

4. The heat pump device according to claim 1 , wherein the first loop is arranged for transfer of thermal energy between on one side of the first loop an energy well and on the other side of the first loop a heat pump by means of a first pump device, arranged to circulate the first heat carrier in the first loop.

5. The heat pump device according to claim 1 , wherein the second loop comprises at least one additional heat exchanger, whereby the second loop is arranged for transfer of thermal energy between on one side of the second loop the heat pump and on the other side of the second loop the additional heat exchanger by utilizing a second pump device arranged to circulate the second heat carrier in the second loop.

6. The heat pump device according to claim 5 , wherein the second loop comprises a first additional heat exchanger which is thermally connected to a hot-water tank, a second additional heat exchanger which is thermally connected to an energy buffer device and a valve arrangement, in that a control device is arranged to control the valve arrangement so that the heat carrier either is directed to the first additional heat exchanger or to the second additional heat exchanger when the heat pump is set to transfer thermal energy from a first side to a second side of the heat pump, and in that the control device is arranged to control the valve arrangement so that the heat carrier is directed to the second additional heat exchanger when the heat pump is set to transfer thermal energy from its second side to its first side.

7. The heat pump device according to claim 6 , wherein a thermal coupling device is arranged to transfer thermal energy from the energy buffer device to a first distribution system for heat when the device is set to heating mode operation, and in that the thermal coupling device is arranged to transfer thermal energy from a second distribution system for coldness to the energy buffer device when the device is set to cooling mode operation.

8. The heat pump device according to claim 1 , wherein the first loop and the second loop together only comprise a single expansion tank.

9. The heat pump device according to claim 1 , wherein the first loop is arranged with a refilling device, arranged to allow simultaneous filling of heat carrier to both the first loop and to the second loop.

10. The heat pump device according to claim 1 , wherein the heat carrier is freeze resistant down to at least −10° C.

11. The heat pump device according to claim 1 , wherein the heat carrier comprises water with 30% ethyl alcohol.

12. The heat pump device according to claim 1 , wherein the conduit is at least 50 cm long and the conduit has an inner diameter that is maximally 10 mm.

13. The heat pump device according to claim 2 , wherein the first heat exchanger has the same capacity as the second heat exchanger.

14. The heat pump device according to claim 2 , wherein the first loop is arranged for transfer of thermal energy between on one side of the first loop an energy well and on the other side of the first loop a heat pump by means of a first pump device, arranged to circulate the first heat carrier in the first loop.

15. The heat pump device according to claim 2 , wherein the second loop comprises at least one additional heat exchanger, whereby the second loop is arranged for transfer of thermal energy between on one side of the second loop the heat pump and on the other side of the second loop the additional heat exchanger by utilizing a second pump device arranged to circulate the second heat carrier in the second loop.

16. The heat pump device according to claim 2 , wherein the second loop comprises a first additional heat exchanger which is thermally connected to a hot-water tank, a second additional heat exchanger which is thermally connected to an energy buffer device and a valve arrangement, in that a control device is arranged to control the valve arrangement so that the heat carrier either is directed to the first additional heat exchanger or to the second additional heat exchanger when the heat pump is set to transfer thermal energy from a first side to a second side of the heat pump, and in that the control device is arranged to control the valve arrangement so that the heat carrier is directed to the second additional heat exchanger when the heat pump is set to transfer thermal energy from its second side to its first side.

17. The heat pump device according to claim 16 , wherein a thermal coupling device is arranged to transfer thermal energy from the energy buffer device to a first distribution system for heat when the device is set to heating mode operation, and in that the thermal coupling device is arranged to transfer thermal energy from a second distribution system for coldness to the energy buffer device when the device is set to cooling mode operation.

18. The heat pump device according to claim 2 , wherein the first loop and the second loop together only comprise a single expansion tank.

19. The heat pump device according to claim 2 , wherein the first loop is arranged with a refilling device, arranged to allow simultaneous filling of heat carrier to both the first loop and to the second loop.

20. The heat pump device according to claim 2 , wherein the heat carrier is freeze resistant down to at least −10° C.