Method of manufacturing organic light-emitting display apparatus and organic light-emitting display apparatus manufactured by using the method

1. A method of manufacturing an organic light-emitting display apparatus, the method comprising:

continuously depositing an organic layer of a linear pattern on a substrate, the substrate including a plurality of panels arranged in a direction, and the linear pattern being continuous between adjacent panels of the plurality of panels;

depositing a second electrode on the organic layer;

forming a passivation layer on the second electrode to cover the second electrode; and

after the forming of the passivation layer, removing the organic layer from a peripheral region of a first panel of the adjacent panels and from a peripheral region of a second panel of the adjacent panels that is adjacent the peripheral region of the first panel along the direction.

2. The method of claim 1 ,

wherein the depositing of the second electrode on the organic layer comprises depositing the second electrode on the organic layer for each of the plurality of panels, and

wherein the forming of the passivation layer on the second electrode comprises forming the passivation layer on the second electrode to cover the second electrode.

3. The method of claim 1 ,

wherein the depositing of the second electrode on the organic layer comprises continuously depositing the second electrode of a linear pattern on the organic layer, and

wherein the forming of the passivation layer on the second electrode comprises continuously forming the passivation layer of a linear pattern on the second electrode to cover the second electrode.

4. The method of claim 1 , wherein the passivation layer comprises one or more materials selected from the group consisting of tris(8-hydroxyquinolinato)aluminum (Alq 3 ), a phenylcarbazole-based compound, and a fluorene-hased compound.

5. The method of claim 1 , wherein the continuous depositing of the organic layer of the linear pattern on the substrate comprises:

providing a thin film deposition apparatus comprising a deposition source continuing a deposition material, a deposition source nozzle unit that is arranged at a side of the deposition source and includes a plurality of deposition source nozzles, and a patterning slit sheet that is arranged to face the deposition source nozzle unit and has a plurality of patterning slits formed therein, such that the thin film deposition apparatus is spaced apart from the substrate;

moving at least one of the thin film deposition apparatus or the substrate relative to the other during the depositing; and

spraying the deposition material from the deposition source to be deposited by passing through the patterning slit sheet and forming a pattern on the substrate.

6. The method of claim 5 , wherein the patterning slit sheet is smaller than the substrate in at least one of a first direction or a second direction perpendicular to the first direction.

7. The method of claim 5 ,

wherein the deposition source nozzles are arranged in the deposition nozzle unit in a first direction,

wherein the patterning slits are arranged in the patterning slit sheet in the first direction, and

wherein the thin film deposition apparatus further comprises a shielding plate assembly that is arranged in the first direction between the deposition source nozzle unit and the patterning slit sheet and comprises a plurality of shielding plates that divide a space between the deposition source nozzle unit and the patterning slit sheet into a plurality of deposition spaces.

8. The method of claim 7 , wherein each of the plurality of shielding plates extends in a second direction that is substantially perpendicular to the first direction.

9. The method of claim 7 , wherein the shielding plate assembly comprises a first shielding plate assembly that comprises a plurality of first shielding plates, and a second shielding plate assembly that comprises a plurality of second shielding plates.

10. The method of claim 9 , wherein each of the plurality of first shielding plates and each of the plurality of second shielding plates is formed in a second direction that is substantially perpendicular to the first direction, and divides a space between the deposition source nozzle unit and the patterning slit sheet into a plurality of deposition spaces.

11. The method of claim 5 ,

wherein the deposition source nozzles are arranged in the deposition source nozzle unit in a first direction, and

wherein the patterning slits are arranged in the patterning slit sheet in a second direction perpendicular to the first direction.

12. The method of claim 11 , wherein the deposition source, the deposition source nozzle unit, and the patterning slit sheet are integrally formed with each other by being coupled to each other by a connection member.

13. The method of claim 12 , wherein the connection member guides a flow path of the deposition material.

14. The method of claim 12 , wherein the connection member is formed to seal from the outside a space between the deposition source, the deposition source nozzle unit, and the patterning slit sheet.

15. The method of claim 1 , wherein the continuous depositing of the organic, layer of the linear pattern on the substrate comprises:

providing a thin film deposition apparatus comprising:

a conveyer unit comprising a transfer unit that fixes the substrate and moves along with the substrate, a first conveyer unit that moves the transfer unit to which the substrate is fixed in a first direction, and a second conveyer unit that moves the transfer unit from which the substrate is separated in a direction opposite to the first direction when the depositing has been completed;

a loading unit that fixes the substrate to the transfer unit;

a deposition unit comprising a chamber that is in vacuum, and at least one organic layer deposition assembly that deposits the organic layer on the substrate fixed to the transfer unit transferred from the loading unit; and

an unloading unit that separates from the transfer unit the substrate on which the deposition has been completed while passing through the deposition unit, such that the thin film deposition apparatus and the substrate are spaced apart from each other;

moving at least one of the thin film deposition apparatus or the substrate relative to the other during the depositing; and

spraying the deposition material from the deposition source to be deposited by passing through a patterning slit sheet of the deposition unit and forming a pattern on the substrate.

16. The method of claim 15 ,

wherein the transfer unit circulates between the first conveyer unit and the second conveyer unit, and

wherein the substrate fixed to the transfer unit is spaced apart by a distance from the organic layer deposition assembly while being moved by the first conveyer unit.

17. The method of claim 16 , wherein the first conveyer unit and the second conveyer unit pass through the deposition unit.

18. The method of claim 16 , wherein the first conveyer unit and the second conveyer unit are arranged vertically in parallel.

19. The method of claim 16 , wherein the first conveyer unit sequentially moves the transfer unit to the loading unit, the deposition unit, and the unloading unit.

20. The method of claim 16 , wherein the second conveyer unit sequentially moves the transfer unit to the unloading unit, the deposition unit, and the loading unit.

21. The method of claim 1 , wherein the removing of the organic layer between the adjacent panels comprises removing the organic layer by chemical etching using plasma containing oxygen (O 2 ).

22. The method of claim 4 , wherein an inorganic layer is further formed on the passivation layer.

23. The method of claim 21 , further comprising, before the removing of the organic layer, disposing a plasma shielding plate on the passivation layer.