IP Library › Granted Patent US 8,958,225
Granted Patent B2
US 8,958,225 · App. 13/932,110 · Granted Feb 17, 2015

Electric power converter

Inventors: Hiromi Ichijo (Chiryu, JP); Shoji Sakai (Toyota, JP)
Assignee: Denso Corporation
H02M1/00H01L23/473H01L23/4006H01L25/117H02M7/003H01L2924/0002
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 8,958,225
App. No.
13/932,110
Granted
Feb 17, 2015
Kind
B2
Abstract

An electric power converter has a semiconductor module that has a switching element therein, cooling pipes that contact with heat radiating surfaces of the semiconductor module and cool the semiconductor module, and a capacitor module formed by sealing a capacitor element therein by a potting material. A piled unit is formed by piling the semiconductor module and the cooling pipes. A direction in which the semiconductor module and the cooling pipes are piled is defined as a piling direction. The piled unit is sandwiched between the capacitor module disposed in a first end side in the piling direction of the piled unit and a pressing member disposed in a second end side in the piling direction of the piled unit. The first end of the piled unit is contacted to a potting surface that is a surface of the potting material in the capacitor module.

Claims (26)

1. An electric power converter having a semiconductor module that has a switching element therein;

cooling pipes that contact with heat radiating surfaces of the semiconductor module and cool the semiconductor module; and

a capacitor module formed by sealing a capacitor element therein by a potting material; comprising:

a piled unit formed by piling the semiconductor module and the cooling pipes, a direction where the semiconductor module and the cooling pipes are piled is defined as a piling direction, the piled unit is sandwiched between the capacitor module disposed in a first end side in the piling direction of the piled unit and a pressing member disposed in a second end side in the piling direction of the piled unit; and

the first end of the piled unit is contacted to a potting surface that is a surface of the potting material in the capacitor module.

2. The electric power converter according to claim wherein,

a press-contacted surface with the pressing member and a press-contacted surface with the potting surface of the piled unit overlap with the switching element in the piling direction.

3. The electric power converter according to claim 2 , wherein,

the semiconductor module has a plurality of switching elements therein, and the plurality of switching elements overlap with the press-contacted surface with the pressing member and the press-contacted surface with the potting surface of the piled unit in the piling direction.

4. The electric power converter according to claim 3 ,

the plurality of switching elements is arranged along a direction that intersects perpendicularly with the piling direction.

5. The electric power converter according to claim 1 , wherein,

the semiconductor module has heat radiating surfaces on a pair of principal surfaces, and the cooling pipes are arranged to contact onto both sides of the heat radiating surfaces.

6. The electric power converter according to claim 1 , wherein,

each of the cooling pipes has a coolant channel therein where cooling media circulates, and

signal terminals and power terminals disposed in the semiconductor module are projected in a direction that intersects perpendicularly with both a circulating direction of the cooling medium and the piling direction in the cooling pipes.

7. The electric power converter according to claim 1 , wherein,

a control circuit board having a control circuit that controls the conductor module is disposed next to the pressing member in a side opposite to the piled unit under the condition where a normal direction of a principal surface of the control circuit board matches the piling direction;

signal terminals disposed in the semiconductor module are connected to the control circuit board; and

the signal terminals are disposed inside the capacitor module and the control circuit board when seen from the piling direction.

8. The electric power converter according to claim 1 ,

the pressing member is fixed to the capacitor module.

9. The electric power converter according to claim wherein,

the capacitor module has a guiding section that positions the piled unit in a direction that intersects perpendicularly to the piling direction.

10. The electric power converter according to claim 1 , wherein,

an elastic member is disposes in the pressing member where at least a portion of the pressing member that contacts to the piled unit.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jul 1, 2013
From: ICHIJO, HIROMI; SAKAI, SHOJI
To: DENSO CORPORATION
Reel/Frame 030718/0222 →
Priority Claims (1)
JP 2012-148645 · Jul 2, 2012 · national
Continuity (1)
Related Publication 20140003111A1 · Jan 2, 2014