Encapsulated arrays with barrier layer covered tiles
Encapsulated arrays with tiles covered with a barrier layer are disclosed. Tiles formed of silicon carbide, and wrapped with a barrier layer, are encapsulated with a base metal formed of a steel alloy. During a casting process, to fabricate the encapsulated arrays, the barrier layer prevents the steel alloy and/or the silicon carbide from compromising each other.
1. A method comprising:
encapsulating a solid ceramic tile in a barrier layer comprising a compressible layer comprising alumina fiber encapsulating the solid ceramic tile and a refractory layer comprising a metal film encapsulating the alumina fiber encapsulating the solid ceramic tile; and
casting a steel alloy around the barrier layer and the solid ceramic tile, the steel alloy applying a compression force and the alumina fiber damping the compression force applied by the steel alloy to provide crush protection between the steel alloy and the solid ceramic tile, and the refractory layer preventing the steel alloy from reacting with the solid ceramic tile.
2. The method of claim 1 , further comprising:
cooling the steel alloy and the solid ceramic tile.
3. The method of claim 2 , wherein the compressible layer provides crush protection between the steel alloy and the solid ceramic tile during the cooling of the steel alloy and the solid ceramic tile.
4. The method of claim 1 , wherein the refractory layer prevents the steel alloy from reacting with the solid ceramic tile during the casting of the steel alloy around the solid ceramic tile.
5. The method of claim 1 , wherein the metal film comprises an electroplated deposit, and the electroplated deposit encapsulates the compressible layer and the solid ceramic tile.
6. The method of claim 1 , wherein the metal film comprises a powder coat, and the powder coat encapsulates the compressible layer and the solid ceramic tile.
7. The method of claim 1 , wherein the metal film comprises a paint coating, and the paint coating encapsulates the compressible layer and the solid ceramic tile.
8. The method of claim 1 , wherein the solid ceramic tile comprises silicon carbide.
9. A method comprising:
providing an array of solid ceramic tiles comprising:
a first layer, encapsulating each solid ceramic tile of the array of solid ceramic tiles, to prevent a steel alloy from reacting with the array of solid ceramic tiles during the casting of the steel alloy around the array of solid ceramic tiles; and
a second layer, disposed between the first layer and each solid ceramic tile, the second layer to dampen a compression force applied by the steel alloy to provide crush protection between the steel alloy and each solid ceramic tile during a cooling of the composite array; and
casting the steel alloy around the array of solid ceramic tiles.
10. The method of claim 9 , wherein each solid ceramic tile comprises silicon carbide.
11. The method of claim 9 , wherein the first layer comprises a metal film and the second layer comprises an alumina fiber.
12. A method comprising:
individually encapsulating a single element formed of silicon carbide in a barrier layer, including individually encapsulating the silicon carbide element in a compressible layer; and
casting a metal around the barrier layer and the silicon carbide element,
wherein the barrier layer prevents interaction of the metal and the silicon carbide element during a casting of the metal around the silicon carbide element, and during a cooling of the metal, and wherein the compressible layer provides crush protection between the metal and the silicon carbide element during the cooling of the metal.
13. The method of claim 12 , wherein individually encapsulating the silicon carbide element comprises:
individually encapsulating the silicon carbide element in a refractory layer to prevent the metal from reacting with the silicon carbide element during the casting of the metal around the silicon carbide element.
14. The method of claim 13 , wherein the refractory layer comprises a metal film individually encapsulating the compressible layer and the silicon carbide element.
15. The method of claim 14 , wherein the metal film has a thickness of at least about 0.001 inches (0.002 centimeters), and at most about 0.009 inches (0.02 centimeters).
16. The method of claim 13 , wherein the compressible layer comprises an alumina fiber disposed between the refractory layer and the silicon carbide element.
17. The method of claim 13 , wherein the compressible layer has a thickness of at least about 0.05 inches (0.13 centimeters), and at most about 0.06 inches (0.15 centimeters).
18. A method comprising:
encapsulating a solid ceramic element in a barrier layer; and
casting a metal around the barrier layer and the solid ceramic element, wherein the barrier layer comprises:
a compressible layer to provide crush protection between the metal and the solid ceramic element after the casting of the metal and during a cooling of the metal; and
a refractory layer to prevent the metal from reacting with the solid ceramic element.
19. The method of claim 18 , wherein the refractory layer comprises a metal film individually encapsulating the compressible layer and the solid ceramic element.
20. The method of claim 18 , wherein the compressible layer comprises an alumina fiber disposed between the refractory layer and the solid ceramic element.