CMOS compatible MEMS microphone and method for manufacturing the same
The present invention relates to a CMOS compatible MEMS microphone, comprising: an SOI substrate, wherein a CMOS circuitry is accommodated on its silicon device layer; a microphone diaphragm formed with a part of the silicon device layer, wherein the microphone diaphragm is doped to become conductive; a microphone backplate including CMOS passivation layers with a metal layer sandwiched and a plurality of through holes, provided above the silicon device layer, wherein the plurality of through holes are formed in the portions thereof opposite to the microphone diaphragm, and the metal layer forms an electrode plate of the backplate; a plurality of dimples protruding from the lower surface of the microphone backplate opposite to the diaphragm; and an air gap, provided between the diaphragm and the microphone backplate, wherein a spacer forming a boundary of the air gap is provided outside of the diaphragm or on the edge of the diaphragm.
1. A method for manufacturing a CMOS compatible MEMS microphone, comprising:
forming a microphone diaphragm by patterning the silicon device layer of an SOI substrate and doping the microphone diaphragm so as to make the microphone diaphragm conductive;
forming a CMOS dielectric oxide layer on the silicon device layer and the microphone diaphragm;
forming a plurality of deep trenches and a plurality of shallow trenches in the CMOS dielectric oxide layer, wherein the deep trenches are formed vertically from the upper surface of the CMOS dielectric oxide layer to the upper surface of the silicon device layer, the shallow trenches are formed vertically from the upper surface of the CMOS dielectric oxide layer, opposite to the microphone diaphragm, to a certain depth of the CMOS dielectric oxide layer;
forming isolation walls and a plurality of dimples by depositing a CMOS passivation layer into the trenches;
forming a microphone backplate on the CMOS dielectric oxide layer, by sequentially depositing a CMOS passivation layer, a metal layer and a CMOS passivation layer, with a plurality of through holes formed in the portion of the microphone backplate opposite to the microphone diaphragm;
forming a back hole by removing the portion of the SOI substrate underneath the microphone diaphragm; and
forming an air gap by removing the CMOS dielectric oxide layer other than the portions of the CMOS dielectric oxide layer confined by the plurality of deep trenches.
2. The method of claim 1 , wherein the step of forming a CMOS dielectric oxide layer further comprising:
forming a plurality of CMOS dielectric oxide layers on the silicon device layer and the microphone diaphragm,
wherein a metal interconnection column is formed in the portion of CMOS dielectric oxide layers above the microphone diaphragm, during forming the plurality of CMOS dielectric oxide layers, the metal interconnection column is formed with CMOS dielectric silicon oxide layers, vias and CMOS metal layers.
3. The method of claim 2 , wherein the metal interconnection column is provided on the center of the microphone diaphragm.
4. The method of claim 3 , wherein the microphone diaphragm is separate from other parts of the silicon device layer.
5. The method of claim 2 , wherein the metal interconnection column is provided on one edge of the microphone diaphragm.