Semiconductor device
A semiconductor device includes a buffer layer, a channel layer and a barrier layer formed over a substrate, a trench penetrating through the barrier layer to reach the middle of the channel layer, and a gate electrode disposed inside the trench via a gate insulating film. The channel layer contains n-type impurities, and a region of the channel layer positioned on a buffer layer side has an n-type impurity concentration larger than a region of the channel layer positioned on a barrier layer side, and the buffer layer is made of nitride semiconductor having a band gap wider than that of the channel layer. The channel layer is made of GaN and the buffer layer is made of AlGaN. The channel layer has a channel lower layer containing n-type impurities at an intermediate concentration and a main channel layer formed thereon and containing n-type impurities at a low concentration.
1. A semiconductor device comprising:
a first nitride semiconductor layer formed over a substrate;
a second nitride semiconductor layer formed on the first nitride semiconductor layer;
a third nitride semiconductor layer formed on the second nitride semiconductor layer and made of nitride semiconductor having a band gap wider than that of the second nitride semiconductor layer;
a trench penetrating through the third nitride semiconductor layer to reach a middle of the second nitride semiconductor layer; and
a gate electrode disposed inside the trench via a gate insulating film,
wherein the second nitride semiconductor layer contains n-type impurities,
a region of the second nitride semiconductor layer positioned on a first nitride semiconductor layer side has a concentration of the n-type impurities larger than a region of the second nitride semiconductor layer positioned on a third nitride semiconductor layer side, and
the first nitride semiconductor layer is made of nitride semiconductor having a band gap wider than that of the second nitride semiconductor layer or nitride semiconductor containing p-type impurities.
2. The semiconductor device according to claim 1 ,
wherein the second nitride semiconductor layer has a first layer containing n-type impurities at a first concentration and a second layer formed on the first layer and containing n-type impurities at a second concentration lower than the first concentration.
3. The semiconductor device according to claim 2 ,
wherein the first concentration is in a range of 1×10 18 /cm 3 or more to less than 1×10 19 /cm 3 , and the second concentration is in a range of 1×10 17 /cm 3 or more to less than 1×10 18 /cm 3 .
4. The semiconductor device according to claim 2 ,
wherein the second nitride semiconductor layer has an undoped third layer below the first layer.
5. The semiconductor device according to claim 2 , further comprising:
a source electrode and a drain electrode formed over the third nitride semiconductor layer on both sides of the gate electrode.
6. The semiconductor device according to claim 5 ,
wherein connection between the source electrode and the third nitride semiconductor layer and connection between the drain electrode and the third nitride semiconductor layer are ohmic connections.
7. The semiconductor device according to claim 5 , further comprising:
an n-type impurity region in contact with a side surface portion of the trench positioned on a drain electrode side.
8. The semiconductor device according to claim 7 ,
wherein the impurity region includes a partial region of the third nitride semiconductor layer and a partial region of the second nitride semiconductor layer, and the partial regions contain silicon (Si).
9. The semiconductor device according to claim 7 , further comprising:
another n-type impurity region in contact with a side surface portion of the trench positioned on a source electrode side.
10. The semiconductor device according to claim 9 ,
wherein the other n-type impurity region extends to a portion below the source electrode.
11. A semiconductor device comprising:
a first nitride semiconductor layer formed over a substrate;
a second nitride semiconductor layer formed on the first nitride semiconductor layer;
a third nitride semiconductor layer formed on the second nitride semiconductor layer and made of nitride semiconductor having a band gap wider than that of the second nitride semiconductor layer;
a trench penetrating through the third nitride semiconductor layer to reach a middle of the second nitride semiconductor layer; and
a gate electrode disposed inside the trench via a gate insulating film,
wherein the second nitride semiconductor layer contains n-type impurities,
a region of the second nitride semiconductor layer positioned on a first nitride semiconductor layer side has a concentration of the n-type impurities smaller than a region of the second nitride semiconductor layer positioned on a third nitride semiconductor layer side, and
the first nitride semiconductor layer is made of nitride semiconductor having a band gap wider than that of the second nitride semiconductor layer or nitride semiconductor containing p-type impurities.
12. The semiconductor device according to claim 11 ,
wherein the second nitride semiconductor layer has an undoped first layer and a second layer formed on the first layer and containing n-type impurities at a first concentration.
13. The semiconductor device according to claim 12 ,
wherein the first concentration is in a range of 1×10 17 /cm 3 or more to less than 1×10 18 /cm 3 .
14. The semiconductor device according to claim 12 , further comprising:
a source electrode and a drain electrode formed over the third nitride semiconductor layer on both sides of the gate electrode.
15. The semiconductor device according to claim 14 ,
wherein connection between the source electrode and the third nitride semiconductor layer and connection between the drain electrode and the third nitride semiconductor layer are ohmic connections.
16. The semiconductor device according to claim 14 , further comprising:
an n-type impurity region in contact with a side surface portion of the trench positioned on a drain electrode side.
17. The semiconductor device according to claim 16 ,
wherein an end portion of the n-type impurity region positioned on a source electrode side is positioned on a source electrode side relative to a side surface portion of the gate electrode inside the trench positioned on a drain electrode side, and
an end portion of the n-type impurity region positioned on a drain electrode side is positioned on a source electrode side relative to an end portion of the gate electrode positioned on a drain electrode side.
18. The semiconductor device according to claim 16 ,
wherein the impurity region includes a partial region of the third nitride semiconductor layer and a partial region of the second nitride semiconductor layer, and the partial regions contain silicon (Si).
19. The semiconductor device according to claim 16 , further comprising:
another n-type impurity region in contact with a side surface portion of the trench positioned on a source electrode side.
20. The semiconductor device according to claim 19 ,
wherein the other n-type impurity region extends to a portion below the source electrode.