IP Library › Granted Patent US 8,969,865
Granted Patent B2
US 8,969,865 · App. 12/097,869 · Granted Mar 3, 2015

Semiconductor film composition

Inventors: Gregory Herman (Albany, OR); David Punsalan (Portland, OR); Randy Hoffman (Corvallis, OR); Jeremy Anderson (Corvallis, OR); Douglas Keszler (Corvallis, OR); David Blessing (Vancouver, WA)
Assignee: Hewlett-Packard Development Company, L.P.
H01L21/02628H01L21/02554H01L21/02565H01L29/7869
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Quick Facts
Patent No.
US 8,969,865
App. No.
12/097,869
Granted
Mar 3, 2015
Kind
B2
Abstract

A semiconductor film composition includes an oxide semiconductor material. At least one polyatomic ion is incorporated into the oxide semiconductor material.

Claims (13)

1. A semiconductor film composition, comprising:

an oxide semiconductor material; and

at least one polyatomic ion incorporated into the oxide semiconductor material as a replacement ion for an anion entity or a cation entity of an analog of the oxide semiconductor material, wherein the analog is the oxide semiconductor material with the anion entity or the cation entity and without the polyatomic ion;

wherein the semiconductor film composition is SnO 1.7 (PO 4 ) 0.2 , indium tin oxide sulfate or indium tin oxide phosphate.

2. The semiconductor film composition as defined in claim 1 wherein the at least one polyatomic ion is selected from sulfates, borates, phosphates, tungstates, silicates, and combinations thereof.

3. The semiconductor film composition as defined in claim 1 wherein a liquid precursor of the semiconductor film composition is adapted to substantially inhibit crystallization during processing.

4. The semiconductor film composition as defined in claim 1 wherein the polyatomic ion is an anion or a cation.

5. The semiconductor film composition as defined in claim 1 wherein: the anion entity of the analog of the oxide semiconductor material is an O 2− anion; and the polyatomic ion is a phosphate or a sulfate.

6. The semiconductor film composition as defined in claim 1 wherein the semiconductor film composition is substantially amorphous.

7. A semiconductor film composition, comprising:

an oxide semiconductor material; and

at least one polyatomic ion incorporated into the oxide semiconductor material as a replacement ion for an anion entity or a cation entity of an analog of the oxide semiconductor material, wherein the analog is the oxide semiconductor material with the anion entity or the cation entity and without the polyatomic ion;

wherein the semiconductor film composition is SnO 1.7 (PO 4 ) 0.2 and the analog is SnO 2 .

Continuity (2)
Continuation 11248819 · Oct 12, 2005
Related Publication 20100044698A1 · Feb 25, 2010