A method includes forming a Micro-Electro-Mechanical System (MEMS) device on a front surface of a substrate. After the step of forming the MEMS device, a through-opening is formed in the substrate, wherein the through-opening is formed from a backside of the substrate. The through-opening is filled with a dielectric material, which insulates a first portion of the substrate from a second portion of the substrate. An electrical connection is formed on the backside of the substrate. The electrical connection is electrically coupled to the MEMS device through the first portion of the substrate.
1. A device comprising:
a substrate;
a Micro-Electro-Mechanical System (MEMS) device on a front surface of the substrate;
a dielectric material penetrating through the substrate, wherein the dielectric material forms a ring, wherein an entirety of the ring is formed of a homogeneous material, and wherein the ring separates the substrate into:
a first portion encircled by the ring; and
a second portion outside of the ring, wherein the first portion is electrically insulated from the second portion; and
an electrical connection on a backside of the substrate, wherein the electrical connection is electrically coupled to the MEMS device through the first portion of the substrate.
2. The device of claim 1 , wherein the MEMS device comprises a capacitor, and wherein the electrical connection is electrically connected to a capacitor plate of the capacitor.
3. The device of claim 1 , wherein the dielectric material extends to contact a back surface of the substrate.
4. The device of claim 1 , wherein the dielectric material comprises a photosensitive material.
5. The device of claim 1 , wherein the substrate comprises a silicon substrate doped with a p-type impurity.
6. The device of claim 1 , wherein the substrate comprises a silicon substrate doped with an n-type impurity.
7. The device of claim 1 further comprising:
an oxide on the front surface of the substrate; and
a contact plug penetrating through the oxide and electrically coupling the first portion of the substrate to the MEMS device.
8. A device comprising:
a semiconductor substrate;
a Micro-Electro-Mechanical System (MEMS) device on a first side of the semiconductor substrate, wherein the MEMS device comprises a capacitor, and wherein the capacitor comprises a first capacitor plate and a second capacitor plate; and
a first conductive trace on a second side of the semiconductor substrate, wherein the first side and the second side are opposite sides of the semiconductor substrate, and wherein the first conductive trace is electrically connected to the first capacitor plate through a first portion of the semiconductor substrate.
9. The device of claim 8 , wherein the semiconductor substrate further comprises a second portion encircling the first portion of the semiconductor substrate, wherein the first portion and the second portion of the semiconductor substrate are formed of an identical semiconductor material.
10. The device of claim 9 , wherein the first portion and the second portion have first surfaces coplanar with each other, and second surfaces coplanar with each other, with the first surfaces and the second surfaces being opposite surfaces of the semiconductor substrate.
11. The device of claim 8 further comprising a dielectric ring encircling the first portion of the semiconductor substrate.
12. The device of claim 11 , wherein the dielectric ring comprises a polymer.
13. The device of claim 11 , wherein the dielectric ring comprises a photo sensitive epoxy.
14. The device of claim 11 , wherein the dielectric ring comprises bisbenzocyclobutene (BCB).
15. The device of claim 8 , wherein the first capacitor plate comprises a proof mass of the MEMS device.
16. The device of claim 8 further comprising a second conductive trace on the second side of the semiconductor substrate, wherein the second conductive trace is electrically connected to the second capacitor plate through a second portion of the semiconductor substrate.
17. A device comprising:
a silicon substrate;
a Micro-Electro-Mechanical System (MEMS) device on a first side of the silicon substrate;
a dielectric material penetrating through the silicon substrate, wherein the dielectric material forms a ring, and wherein the ring separates the silicon substrate into:
a first portion encircled by the ring; and
a second portion outside of the ring, wherein the first portion is electrically insulated from the second portion, and wherein the first portion and the second portion comprise silicon regions; and
an electrical connection on a second side of the silicon substrate, wherein the electrical connection is electrically coupled to the MEMS device through the first portion of the silicon substrate.
18. The device of claim 17 , wherein an entirety of the ring is formed of a homogeneous material.
19. The device of claim 17 , wherein the dielectric material comprises a photo sensitive polymer.
20. The device of claim 17 , wherein the MEMS device comprises a proof mass, and wherein the electrical connection is electrically connected to the proof mass.