Thermally enhanced heat spreader for flip chip packaging
A flip chip microelectronic package having a heat spreader is provided. In one embodiment, the microelectronic package comprises a die having a first surface and a second surface, the first surface being coupled to a substrate; a thermal interface material disposed in thermal conductive contact with the second surface of the die; and a heat spreader adapted for dissipating heat from the die, the heat spreader disposed in thermal conductive contact with the thermal interface material. The heat spreader includes a lid having an inner chamber therein defined by a first wall and a second wall, the second wall securely joined to the first wall to seal the chamber, the lid being mounted to the substrate and a wick layer positioned in the chamber.
1. A microelectronic package, comprising:
a die having a first surface and a second surface, the first surface coupled to a substrate;
a thermal interface material disposed in thermal conductive contact with the second surface of the die; and
a heat spreader configured to dissipate heat from the die, the heat spreader disposed in thermal conductive contact with the thermal interface material, the heat spreader comprising:
a lid having an inner chamber therein defined by a first wall and a second wall, the second wall securely joined to the first wall to seal the inner chamber,
a wick layer positioned in the inner chamber, and
an attachment frame securing the lid to the substrate;
wherein the attachment frame extends continuously for 360 degrees in a circumferential direction of the lid, and
wherein the attachment frame has a first member and a second member transverse to the first member, the first member engaging the lid from above, a bottom surface of the second member secured to the top surface of the substrate, the attachment frame extending continuously from the first member to the second member.
2. The microelectronic package of claim 1 , wherein the lid comprises copper, copper alloy, copper tungsten (CuW), or aluminum-silicon-carbide (AlSiC).
3. The microelectronic package of claim 1 , further comprising:
at least one securing device securing the lid to the attachment frame, wherein the at least one securing device is free of direct contact with the substrate.
4. A microelectronic package, comprising:
a substrate;
a die having a bottom surface and a top surface, the bottom surface bonded to a top surface of the substrate;
a thermal interface material disposed on top and in thermal conductive contact with the top surface of the die; and
a heat spreader configured to dissipate heat from the die, the heat spreader disposed on top and in thermal conductive communication with the thermal interface material, the heat spreader comprising:
a lid having an inner chamber therein defined by a first wall and a second wall, the second wall securely joined to the first wall to seal the inner chamber;
an attachment frame securing the lid to the substrate, and
at least one securing device securing the lid to the attachment frame;
wherein the attachment frame has a first member and a second member transverse to the first member, the first member engaging the lid from above, a bottom surface of the second member above and secured to the top surface of the substrate, the attachment frame extending continuously from the first member to the second member.
5. The microelectronic package of claim 4 , further comprising:
solder bumps coupling the die to the substrate.
6. The microelectronic package of claim 5 , further comprising:
an underfill material filling a gap between the die and the substrate, the underfill material encapsulating the solder bumps.
7. The microelectronic package of claim 4 , wherein the first wall and the second wall of the lid comprise copper.
8. The microelectronic package of claim 7 , wherein the attachment frame comprises copper tungsten (CuW) or aluminum-silicon-carbide (AlSiC).
9. The microelectronic package of claim 4 , wherein the at least one securing device comprises rivets, screws, solder, or adhesives.
10. The microelectronic package of claim 4 , further comprising:
an adhesive positioned between and securing the bottom surface of the second member of the attachment frame and the top surface of the substrate.
11. The microelectronic package of claim 4 , wherein the heat spreader further comprises a working fluid and a wick layer contained in the inner chamber, the wick layer configured to receive the working fluid and positioned along inner surfaces of the first wall and the second wall of the lid.
12. The microelectronic package of claim 11 , wherein the working fluid comprises water, freon, or alcohol.
13. A microelectronic package, comprising:
a substrate;
a die having a bottom surface and a top surface, the bottom surface bonded to a top surface of the substrate;
a thermal interface material disposed on top and in thermal conductive contact with the top surface of the die; and
a heat spreader configured to dissipate heat from the die, the heat spreader disposed on top and in thermal conductive communication with the thermal interface material, the heat spreader comprising:
a lid having an inner chamber therein defined by a first wall and a second wall, the second wall securely joined to the first wall to seal the inner chamber;
an attachment frame securing the lid to the substrate, and
at least one securing device securing the lid to the attachment frame;
wherein the attachment frame has a first member and a second member transverse to the first member, the first member engaging the lid from above, a bottom surface of the second member secured to the top surface of the substrate, the attachment frame extending continuously from the first member to the second member, and
wherein the attachment frame is a full ring having an L-shaped cross-section defined by the first and second members.
14. A method of forming microelectronic packages, comprising:
coupling a die to a substrate;
disposing a thermal interface material on a top surface of the die;
disposing a heat spreader, which is configured to dissipate heat from the die, on top and in thermal conductive communication with the thermal interface material, the heat spreader comprising:
a lid having an inner chamber therein defined by a first wall and a second wall, the second wall securely joined to the first wall to seal the inner chamber,
a working fluid contained in the inner chamber, and
a wick layer positioned in the inner chamber and configured to receive the working fluid; and
mounting the heat spreader on the substrate by a monolithic attachment frame, the attachment frame extending continuously for 360 degrees around the lid, a cross-section of the attachment frame including a first member and a second member transverse to the first member, the first member engaging the lid from above, the second member secured to the substrate.
15. The method of claim 14 , wherein
the lid comprises copper, and
the attachment frame comprises copper tungsten (CuW) or aluminum-silicon-carbide (AlSiC).
16. The method of claim 14 , wherein the mounting further comprises securing the first member to the lid by at least one securing device, the at least one securing device free of direct contact with the substrate.
17. The method of claim 16 , wherein the at least one securing device comprises solder or adhesive.
18. The method of claim 14 , wherein the mounting further comprises securing the first member to the lid by rivets or screws extending through through-holes formed in the first member.
19. The method of claim 14 , wherein the cross-section of the attachment frame is an L-shaped cross-section defined by the first and second members.
20. The method of claim 14 , further comprising:
securing a bottom surface of the second member to a top surface of the substrate by adhesive.