Control method and apparatus
A higher-level controller can correct measured metrology data with residual error values as reported by a lower-level controller. This results in a more accurate process disturbance estimate. A method of control obtains, based on measurement sample definition, a first process variable of a system under control, determines a residual error using the first process variable and a first set point, controls the system using the residual error, obtains, based on the same sample definition, a second process variable, and adjusts the second process variable using the residual error. The method may also include determining, using the adjusted second process variable, one or more first set points for controlling the system by the low-level controller that may vary in correspondence with the sample definition.
1. A method, comprising:
obtaining, using a first controller, a first process variable based on a measurement sample definition;
determining, using the first controller, a first residual error over a wafer based on the first process variable and a first set point, wherein at least the first process variable and the first set point are input parameters of the first controller;
controlling, using the first controller, a system based on the first residual error;
obtaining, using a second controller, a second process variable based on the measurement sample definition;
adjusting, using the second controller, the second process variable based on the first residual error;
determining, using the second controller, a second set point based on the adjusted second process variable;
feeding back, using the second controller, the second set point to the first controller; and
determining, using the first controller, a second residual error, the second residual error being determined by the first controller based on the second set point.
2. The method of claim 1 , wherein the second set point is determined to vary in correspondence with the measurement sample definition.
3. The method of claim 1 , further comprising:
determining, using the second controller, a third residual error based on the adjusted second process variable and a third set point,
wherein the determining of the second set point is based on the third residual error.
4. The method of claim 1 , further comprising:
determining, using the second controller, a third residual error based on the second process variable and a third set point,
wherein the adjusting of the second process variable comprises adjusting the third residual error based on the first residual error,
wherein the determining of the second set point is based on the adjusted third residual error.
5. The method of claim 1 , further comprising controlling the system based on the first set point.
6. The method of claim 1 , wherein the measurement sample definition comprises a plurality of measurement locations with respect to a substrate.
7. A control apparatus, comprising:
a first controller configured to:
obtain, based on a measurement sample definition, a first process variable of a system under control;
determine a first residual error over a wafer based on the first process variable and a first set point, wherein at least the first process variable and the first set point are input parameters of the first controller; and
control the system based on the first residual error; and
a second controller configured to:
obtain, based on the measurement sample definition, a second process variable;
adjust the second process variable based on the first residual error;
determine a second set point based on the adjusted second process variable; and
feed back the second set point to the first controller, wherein the first controller is further configured to determine a second residual error based on the second set point.
8. The control apparatus of claim 7 , wherein the second controller is further configured to determine the second set point to vary in correspondence with the measurement sample definition.
9. The control apparatus of claim 7 , wherein the second controller is further configured to:
determine a third residual error based on the adjusted second process variable and a third set point; and
determine the second set point based on the third residual error.
10. The control apparatus of claim 7 , wherein the second controller is further configured to:
determine a third residual error based on the second process variable and a third set point;
adjust the third residual error based on the first residual error in order to adjust the second process variable; and
determine the second set point based on the adjusted third residual error.
11. The control apparatus of claim 7 , wherein the first controller is further configured to control the system based on the first set point.
12. The control apparatus of claim 7 , wherein the measurement sample definition comprises a plurality of measurement locations with respect to a substrate.
13. A lithographic apparatus, comprising:
a first controller configured to:
obtain, based on a measurement sample definition, a first process variable of a system under control;
determine a first residual error over a wafer based on the first process variable and a first set point, wherein at least the first process variable and the first set point are input parameters of the first controller; and
control the system based on the first residual error; and
a second controller configured to:
obtain, based on the measurement sample definition, a second process variable;
adjust the second process variable based on the first residual error;
determine a second set point based on the adjusted second process variable; and
feed back the second set point to the first controller, wherein the first controller is further configured to determine, a second residual error based on the second set point.
14. A non-transitory computer-readable medium having instructions stored thereon, execution of which by a computing device causes the computing device to perform operations comprising:
obtaining, using a first controller, a first process variable of a system under control based on a measurement sample definition;
determining, using the first controller, a first residual error over a wafer based on the first process variable and a first set point, wherein at least the first process variable and the first set point are input parameters of the first controller;
controlling, using the first controller, the system based on the first residual error;
obtaining, using a second controller, a second process variable based on the measurement sample definition;
adjusting, using the second controller, the second process variable based on the first residual error;
determining, using a second controller, a second set point based on the adjusted second process variable;
feeding back, using the second controller, the second set point to the first controller; and
determining, using the first controller, as second, residual error, the second residual error being determined by the first controller based on the second set point.