IP Library › Granted Patent US 8,974,125
Granted Patent B2
US 8,974,125 · App. 13/595,784 · Granted Mar 10, 2015

Air-cooled optical transceiver module system

Inventors: Laurence R. McColloch (Santa Clara, CA); David J. K. Meadowcroft (San Jose, CA); Paul Yu (Mountain View, CA)
Assignee: Avago Technologies General IP (Singapore) Pte. Ltd.
H04B10/40
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Quick Facts
Patent No.
US 8,974,125
App. No.
13/595,784
Granted
Mar 10, 2015
Kind
B2
Abstract

In an opto-electronic system having one or more optical transceiver modules and an enclosure, air is forced through the interior of the transceiver module to dissipate heat generated by the opto-electronic and electronic elements.

Claims (20)

1. An optical transceiver module system, comprising:

an enclosure having a plurality of bays, each bay having an elongated rectangular receptacle shape extending substantially along a longitudinal axis, each bay having a bay electrical connector;

a cooling fan in the enclosure configured to convey air in a direction corresponding to the longitudinal axis;

a transceiver module plugged into one of the bays, the transceiver module having a nose end and a tail end and extending between the nose end and the tail end in a direction corresponding to the longitudinal axis, the transceiver module comprising:

an electronics subassembly comprising a heat-emitting light source, a heat-emitting electronic device and a substrate having the light source and electronic device mounted thereon, the substrate having a plurality of signal conductors and a generally planar shape elongated in the direction corresponding to the longitudinal axis, the electronics subassembly mated with the bay electrical connector of the one of the bays into which the transceiver module is plugged;

an elongated rectangular transceiver module housing assembly having a shape corresponding to the receptacle shape of the bay to provide a slideable fit with the bay, the transceiver module housing assembly extending between the nose end and the tail end of the transceiver module and having at least one optical receptacle disposed at the nose end of the transceiver module housing assembly for receiving a fiber-optic cable plug connector, the transceiver module housing assembly having a first airflow opening and a second airflow opening separated by an interior cavity portion of the transceiver module housing assembly extending in a direction corresponding to the longitudinal axis, wherein the light source is mounted in the interior cavity portion of the transceiver module housing assembly between the first airflow opening and the second airflow opening; and

an optics subsystem in the transceiver module housing assembly configured to redirect an optical beam between the light source and the optical receptacle.

2. The optical transceiver module system of claim 1 , wherein one of the first and second airflow openings is disposed at the nose end of the transceiver module and has a flow axis oriented in a direction corresponding to the longitudinal axis.

3. The optical transceiver module system of claim 2 , wherein the electronics subassembly comprises an opto-electronics subassembly mounted to the substrate, an optical axis of the light source oriented in a direction corresponding to the longitudinal axis, and further comprising a heat sink attached to the opto-electronics assembly and disposed along the flow axis of the one of the first and second airflow openings.

4. The optical transceiver module system of claim 3 , wherein the opto-electronics subassembly comprises a printed circuit board, a TO-can package in which the light source is mounted, and a flex circuit, the flex circuit coupling signals between the TO-can package and the printed circuit board.

5. The optical transceiver module system of claim 4 , further comprising a driver integrated circuit electrically coupled to the light source and to at least a portion of the signal conductors, the driver integrated circuit coupled to a surface of the printed circuit board and disposed along the flow axis of the one of the first and second airflow openings.

6. The optical transceiver module system of claim 1 , wherein the nose end of the transceiver module is disposed outside the enclosure when the transceiver module is fully plugged into the one of the bays, and one of the first and second airflow openings is disposed outside the enclosure and has a flow axis oriented in a direction corresponding to the longitudinal axis.

7. The optical transceiver module system of claim 6 , wherein the nose end of the transceiver module comprises a metal portion of the transceiver module housing assembly having the one of the first and second airflow openings, and a plastic portion having the optical receptacle forward of the metal portion.

8. The optical transceiver module system of claim 1 , wherein the nose end of the transceiver module is disposed outside the enclosure when the transceiver module is fully plugged into the one of the bays, and one of the first and second airflow openings is disposed outside the enclosure and has a flow axis oriented in a direction transverse to the longitudinal axis.

9. The optical transceiver module system of claim 8 , wherein the nose end of the transceiver module comprises a metal portion of the transceiver module housing assembly having the one of the first and second airflow openings, and a plastic portion having the optical receptacle forward of the metal portion.

10. The optical transceiver module system of claim 9 , wherein the substrate has an aperture between an upper side of the substrate and a lower side of the substrate, and the first and second airflow openings are disposed on opposite sides of the substrate.

11. The optical transceiver module system of claim 10 , further comprising a driver integrated circuit coupled through a thermally conductive path to the metal portion of the transceiver module housing assembly.

12. The optical transceiver module system of claim 1 , wherein the enclosure comprises a plurality of front panel openings, each front panel opening adjacent to one of the bays and adjacent to the nose end of the transceiver module when the transceiver module is fully plugged into the one of the bays, the enclosure providing an air flow passage between one of the first and second airflow openings and the front panel opening when the transceiver module is fully plugged into the one of the bays.

13. The optical transceiver module system of claim 1 , wherein the bay electrical connector comprises an upper connector having a housing in which upper connector fingers are enclosed, a lower connector having a housing in which lower connector fingers are enclosed, and exposed electrical signal conductors extending between the upper connector and lower connector in a direction transverse to the direction corresponding to the longitudinal axis, the exposed electrical signal conductors defining an air flow passage to one of the first and second airflow openings when the transceiver module is fully plugged into the one of the bays.

14. The optical transceiver module system of claim 1 , further comprising a driver integrated circuit coupled through a thermally conductive path to the metal portion of the transceiver module housing assembly.

Assignments (9)
MERGER Recorded Mar 3, 2023
From: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED; BROADCOM INTERNATIONAL PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 062952/0850 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 14, 2020
From: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
To: BROADCOM INTERNATIONAL PTE. LTD.
Reel/Frame 053771/0901 →
CORRECTIVE ASSIGNMENT TO CORRECT THE EXECUTION DATE PREVIOUSLY RECORDED AT REEL: 047422 FRAME: 0464. ASSIGNOR(S) HEREBY CONFIRMS THE MERGER. Recorded Mar 6, 2019
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 048883/0702 →
MERGER Recorded Oct 5, 2018
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: AVAGO TECHNOLOGIES INTERNATIONAL SALES PTE. LIMITED
Reel/Frame 047422/0464 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENTS Recorded Feb 3, 2017
From: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 041710/0001 →
PATENT SECURITY AGREEMENT Recorded Feb 11, 2016
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: BANK OF AMERICA, N.A., AS COLLATERAL AGENT
Reel/Frame 037808/0001 →
TERMINATION AND RELEASE OF SECURITY INTEREST IN PATENT RIGHTS (RELEASES RF 032851-0001) Recorded Feb 2, 2016
From: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 037689/0001 →
PATENT SECURITY AGREEMENT Recorded May 8, 2014
From: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
To: DEUTSCHE BANK AG NEW YORK BRANCH, AS COLLATERAL AGENT
Reel/Frame 032851/0001 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Aug 27, 2012
From: MCCOLLOCH, LAURENCE R.; MEADOWCROFT, DAVID J.K.; YU, PAUL
To: AVAGO TECHNOLOGIES GENERAL IP (SINGAPORE) PTE. LTD.
Reel/Frame 028855/0517 →
Continuity (1)
Related Publication 20140056592A1 · Feb 27, 2014