Apparatus and method for detecting a state of a deposition apparatus
Apparatuses for deposition of one or more layers. In one aspect, an apparatus for deposition of one or more layers includes an anode; a cathode; a vacuum chamber including the anode and the cathode; a sensor configured to detect an electric potential between a section of the at least one anode and a section of the chamber. Furthermore, methods to monitor a device for deposition of one or more layers are also described.
1. An apparatus for deposition of one or more layers, comprising:
an anode;
a cathode;
a vacuum chamber including the anode and the cathode and a vacuum chamber wall;
a sensor configured to directly detect an electric potential between a section of the anode and a section of the vacuum chamber wall, wherein the sensor comprises a resistive element in a circuit path directly connecting the section of the anode and the section of the vacuum chamber wall and the sensor is configured to detect the electric potential by detecting a voltage drop over the resistive element, and wherein based on a threshold value for the detected electric potential an electric short between the anode and the chamber wall is detected; and
a controller circuit coupled to the sensor and configured to receive an output signal indicative of the electric potential generated by the sensor, wherein the controller circuit is configured to generate a warning signal in response to the electric potential being in a predetermined range, and wherein the controller circuit is configured to provide a warning to a user based on the warning signal.
2. The apparatus according to claim 1 , wherein the apparatus is configured so that during normal operation the electrical potential exceeds a first absolute threshold value.
3. The apparatus according to claim 1 , wherein the apparatus comprises a plurality of anodes and a plurality of cathodes.
4. The apparatus according to claim 3 , wherein the apparatus includes n cathodes and n+1 anodes, with n being an integer number greater than 1.
5. The apparatus according to claim 3 , wherein the cathodes and the anodes each have an elongated form and extend substantially in one predetermined direction and wherein the anodes and the cathodes are arranged in an alternating fashion in a direction perpendicular to the predetermined direction of extension of the cathodes.
6. The apparatus according to claim 3 , wherein the anodes are connected to the section of the vacuum chamber wall via one or more electrically resistive elements, and wherein the sensor is configured to detect the electric potential between the section of the anodes and the section of the vacuum chamber wall by detecting a voltage drop over the one or more resistive elements.
7. The apparatus according to claim 3 , wherein the anodes are connected to the section of the vacuum chamber wall via a single electrically resistive element, and
wherein the sensor is configured to detect the electric potential between the section of the anodes and the section of the vacuum chamber wall by detecting a voltage drop over the single electrically resistive element.
8. The apparatus according to claim 6 , wherein each of the anodes is connected exclusively via one or more electrically resistive elements to the section of the vacuum chamber wall, and wherein the sensor is configured to detect an electric potential between the section of each of the anodes and the section of the vacuum chamber wall.
9. The apparatus of claim 1 , wherein the apparatus is a DC sputtering apparatus for thin film application.
10. The apparatus according to claim 1 , wherein the chamber is electrically grounded.
11. The apparatus of claim 1 , further including a switch which is configured to galvanically decouple the sensor from the anode.