Laminate, method for producing same, and method for producing device structure using same
The invention provides a laminate of a substrate, a polyimide film, and a coupling treatment layer interposed therebetween, which provides different delamination strengths between the substrate and the polyimide film to form a prescribed pattern. The invention also provides a method for producing such a laminate formed from at least a substrate and a polyimide film, whereby, using a film obtained by plasma treatment of at least the surface facing the substrate as the polyimide film, coupling agent treatment is performed on at least one of the surfaces facing the substrate and the polyimide film to form a coupling treatment layer, deactivation treatment is performed on a portion of the coupling treatment layer to form a pre-determined pattern, and then pressing and heating are performed with the substrate and polyimide film overlapping.
1. A laminate comprising a substrate, a polyimide film, and a coupling treatment layer interposed therebetween, wherein delamination strength between the substrate and the polyimide film is different between good adhesion parts and easily peeling parts, forming a prescribed pattern.
2. The laminate according to claim 1 , wherein 180-degree peel strength between the substrate and the polyimide film in the easily peeling part is ½ or lower of 180-degree peel strength between the substrate and the polyimide film in the good adhesion part.
3. The laminate according to claim 1 , wherein the polyimide film is a film obtained by reaction of diamines containing an aromatic diamine having a benzoxazole structure and tetracarboxylic acids.
4. A method of producing the laminate of claim 1 , the method comprising:
providing a substrate having at least a first surface;
providing a polyimide film having at least a second surface subjected to plasma treatment;
performing a coupling agent treatment on at least one of the first and second surfaces to form a coupling treatment layer;
carrying out an inactivation treatment of a portion of the coupling treatment layer to form a prescribed pattern; and
laying the polyimide film on the substrate so that the first surface faces the second surface, followed by pressurizing and heating the polyimide film on the substrate to form the laminate comprising the substrate, the polyimide film, and the coupling treatment layer interposed therebetween.
5. The method for producing a laminate according to claim 4 , wherein at least one kind treatment selected from the group consisting of blast treatment, vacuum plasma treatment, atmospheric pressure plasma treatment, corona treatment, active radiation irradiation treatment, active gas treatment, and chemical liquid treatment is carried out as the inactivation treatment.
6. The method for producing a laminate according to claim 5 , wherein at least UV irradiation treatment is carried out as the inactivation treatment.
7. The method for producing a laminate according to claim 4 , wherein the pressurizing and heating treatment is carried out using a roll.
8. The method for producing a laminate according to claim 4 , wherein the pressurizing and heating treatment is carried out in vacuum.
9. The method for producing a laminate according to claim 4 , wherein the pressurizing and heating treatment is carried out separately in pressurizing process and heating process by pressurizing at a temperature lower than 120° C. and then heating at a temperature of 120° C. or higher under low pressure or normal pressure.
10. The method for producing a laminate according to claim 4 , wherein a film treated with acid treatment after the plasma treatment is used as the polyimide film.
11. The method for producing a laminate according to claim 4 , wherein a film obtained by reaction of diamines containing an aromatic diamine having a benzoxazole structure and tetracarboxylic acids is used as the polyimide film.
12. A method for producing a structure having a device formed on a polyimide film, the method comprising:
providing the laminate of claim 1 ;
forming a device on the polyimide film of the laminate;
making a cut in the polyimide film at an easily peeling part of the laminate; and
peeling the polyimide film from the substrate.
13. The laminate according to claim 2 , wherein the polyimide film is a film obtained by reaction of diamines containing an aromatic diamine having a benzoxazole structure and tetracarboxylic acids.
14. A method for producing a structure having a device formed on a polyimide film, the method comprising:
providing the laminate of claim 2 ;
forming a device on the polyimide film of the laminate;
making a cut in the polyimide film at an easily peeling part of the laminate; and
peeling the polyimide film from the substrate.
15. A method for producing a structure having a device formed on a polyimide film, the method comprising:
providing the laminate of claim 2 ;
forming a device on the polyimide film of the laminate;
making a cut in the polyimide film at an easily peeling part of the laminate; and
peeling the polyimide film from the substrate.
16. A method for producing a structure having a device formed on a polyimide film, the method comprising:
providing the laminate of claim 13 ;
forming a device on the polyimide film of the laminate;
making a cut in the polyimide film at an easily peeling part of the laminate; and
peeling the polyimide film from the substrate.