Multilayer ceramic electronic component and method of manufacturing the same
There is provided a multilayer ceramic electronic component including: a ceramic main body including a dielectric layer and internal electrodes disposed to face each other, while having the dielectric layer interposed therebetween; and external electrodes electrically connected to the internal electrodes, wherein the external electrodes include first external electrodes formed on outer surfaces of the ceramic main body and second external electrodes formed outwardly of the first external electrodes, and protective layers including one or more of an oxide layer and a glass layer are formed between the first external electrodes and the second external electrodes.
1. A multilayer ceramic electronic component comprising:
a ceramic main body including a dielectric layer and internal electrodes disposed to face each other, while having the dielectric layer interposed therebetween; and
external electrodes electrically connected to the internal electrodes,
wherein the external electrodes include first external electrodes formed on outer surfaces of the ceramic main body and second external electrodes formed outwardly of the first external electrodes, and protective layers including an oxide layer and a glass layer formed between the first external electrodes and the second external electrodes.
2. The multilayer ceramic electronic component of claim 1 , wherein the oxide layer includes copper oxide (CuO).
3. The multilayer ceramic electronic component of claim 1 , wherein the first external electrodes include a conductive metal of 60 wt % or less of overall weight.
4. The multilayer ceramic electronic component of claim 3 , wherein the conductive metal is one or more selected from the group consisting of copper (Cu), nickel (Ni), silver (Ag), and silver-palladium (Ag—Pd).
5. The multilayer ceramic electronic component of claim 1 , wherein the second external electrodes include a conductive metal of 60 wt % or less of overall weight.
6. The multilayer ceramic electronic component of claim 5 , wherein the conductive metal is one or more selected from the group consisting of copper (Cu), nickel (Ni), silver (Ag), and silver-palladium (Ag—Pd).
7. The multilayer ceramic electronic component of claim 1 , wherein the external electrodes have a plated layer formed thereon.
8. A method of manufacturing a multilayer ceramic electronic component, the method comprising:
preparing a ceramic main body including a dielectric layer and a plurality of internal electrodes disposed to face each other, while having the dielectric layer interposed therebetween;
preparing a conductive paste for external electrodes including a conductive metal;
applying the conductive paste for external electrodes to end portions of the ceramic main body to form first external electrodes such that the first external electrodes are electrically connected to the internal electrodes;
thermally treating the ceramic main body to form protective layers including oxide layers and glass layers on the first external electrodes;
forming second external electrodes on the oxide layers, wherein the oxide layer and the glass layer are formed between the first external electrodes and the second external electrodes; and
firing the ceramic main body.
9. The method of claim 8 , wherein the thermally treating of the ceramic main body is performed within a temperature range of 200° C. to 500° C.
10. The method of claim 8 , wherein the firing of the ceramic main body is performed such that a portion of an oxide included in the oxide layers is reduced to a metal.
11. The method of claim 8 , wherein the oxide layer includes copper oxide (CuO).
12. The method of claim 8 , further comprising forming plated layers on the external electrodes.