IP Library › Granted Patent US 8,993,366
Granted Patent B2
US 8,993,366 · App. 13/931,463 · Granted Mar 31, 2015

High efficiency, lightweight, flexible solar sheets

Inventors: Raymond Chan (Hoffman Estates, IL); Haruki Miyamoto (Schaumburg, IL)
Assignee: MicroLink Devices, Inc.
H01L31/1876H01L31/0508Y02E10/50
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Quick Facts
Patent No.
US 8,993,366
App. No.
13/931,463
Granted
Mar 31, 2015
Kind
B2
Abstract

The method of the invention includes the sequential steps of providing a plurality of solar cells, interconnecting the solar cells using one or more interconnect tabs, attaching the interconnect tabs to a top side of the solar cell to interconnect the plurality of solar cells by coupling an exposed top surface of a first solar cell to a top surface of an adjacent second solar cell, attaching one or more bypass diodes to a top side of the solar cell, then next applying an adhesive to a first film layer, placing the plurality of solar cells onto the first film layer, then next applying an adhesive to a second film layer, placing the plurality of solar cells and first film layer onto the second film layer to form a sheet assembly, and then forming the solar sheet from the sheet assembly.

Claims (27)

1. A method for forming a solar sheet having an array of solar cells, the method comprising the sequential steps of:

providing a plurality of solar cells, wherein a solar cell includes a semiconductor layer formed on top of a backmetal layer leaving a portion of a top surface of the backmetal layer exposed; then next

interconnecting the plurality of solar cells using one or more interconnect tabs by coupling the exposed top surface of the backmetal layer of a first solar cell to a top surface of an adjacent second solar cell; then next

attaching the one or more interconnect tabs to the top side of the solar cell to interconnect the plurality of solar cells by coupling the exposed top surface of the backmetal layer of a first solar cell to a top surface of an adjacent second solar cell;

attaching one or more bypass diodes to a top side of the solar cell to form the array of solar cells; then next

applying an adhesive to a first film layer that is separate and distinct from the array of solar cells;

placing the array of solar cells onto the first film layer; then next

applying an adhesive to a second film layer that is separate and distinct from the array of solar cells;

placing the array of solar cells and the first film layer onto the second film layer to form a sheet assembly, and then

forming the solar sheet from the sheet assembly.

2. The method of claim 1 , wherein the adhesive comprises a pressure sensitive adhesive.

3. The method of claim 2 wherein the adhesive comprises a silicon based material.

4. The method of claim 3 , wherein the step of forming further comprises placing the sheet assembly in a pressure lamination module to form the solar sheet.

5. The method of claim 1 , wherein the adhesive comprises a heat sensitive adhesive.

6. The method of claim 5 , wherein the heat sensitive adhesive comprises a ethylene vinyl acetate material.

7. The method of claim 5 , wherein the step of forming further comprises placing the sheet assembly in a heat vacuum lamination module to form the solar sheet.

8. A method for forming a solar sheet having an array of solar cells, the method comprising the sequential steps of:

providing a plurality of solar cells, wherein a solar cell includes a semiconductor layer formed on top of a backmetal layer leaving a portion of a top surface of the backmetal layer exposed; then next

interconnecting the plurality of solar cells using one or more interconnect tabs by coupling the exposed top surface of the backmetal layer of a first solar cell to a top surface of an adjacent second solar cell; then next

attaching the one or more interconnect tabs to the top side of the solar cell to interconnect the plurality of solar cells by coupling the exposed top surface of the backmetal layer of a first solar cell to a top surface of an adjacent second solar cell;

attaching one or more bypass diodes to a top side of the solar cell to form the array of solar cells; then next

applying a first film layer that is free a separate adhesive layer to the array of solar cells; then next

applying a second film layer that is separate and distinct from the array of solar cells and free of a separate adhesive layer to form a sheet assembly; and then

forming the solar sheet from the sheet assembly.

9. The method of claim 8 , wherein at least the first film layer is formed from a heat sensitive adhesive.

10. The method of claim 9 , wherein the heat sensitive adhesive comprises an ionomer material.

11. The method of claim 10 , wherein the step of forming further comprises placing the sheet assembly in a heat vacuum lamination module to form the solar sheet.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Oct 30, 2013
From: CHAN, RAYMOND; MIYAMOTO, HARUKI
To: MICROLINK DEVICES, INC.
Reel/Frame 031507/0896 →
Continuity (2)
Provisional Application 61665572 · Jun 28, 2012
Related Publication 20140004645A1 · Jan 2, 2014