Proximity sensor having light blocking structure in leadframe
A semiconductor proximity sensor ( 100 ) has a flat leadframe ( 110 ) with a first ( 110 a ) and a second ( 110 b ) surface, the second surface being solderable; the leadframe includes a first ( 111 ) and a second ( 112 ) pad, a plurality of leads ( 113, 114 ), and fingers ( 115, 118 ) framing the first pad, the fingers spaced from the first pad by a gap ( 116 ) which is filled with a clear molding compound. A light-emitting diode (LED) chip ( 120 ) is assembled on the first pad and encapsulated by a first volume ( 140 ) of the clear compound, the first volume outlined as a first lens ( 141 ). A sensor chip ( 130 ) is assembled on the second pad and encapsulated by a second volume ( 145 ) of the clear compound, the second volume outlined as a second lens ( 146 ). Opaque molding compound ( 150 ) fills the space between the first and second volumes of clear compound, forms shutters ( 151 ) for the first and second lenses, and forms walls rising from the frame of fingers to create an enclosed cavity for the LED. A layer ( 180 ) of solder is on the second leadframe surface of the pads, leads, and fingers.
1. A semiconductor proximity sensor comprising:
a flat leadframe having a first and a second surface, the second surface being solderable, the leadframe including a first and a second pad, a plurality of leads, and fingers framing the first pad, the fingers spaced from the first pad by a gap;
clear molding compound filling the gap;
a light-emitting diode (LED) chip assembled on the first pad and encapsulated by a first volume of the clear compound, the first volume outlined as a first lens;
a sensor chip assembled on the second pad and encapsulated by a second volume of the clear compound, the second volume outlined as a second lens;
opaque molding compound filling the space between the first and second volumes of clear compound, forming shutters for the first and second lenses, and forming walls rising from the frame of fingers to create an enclosed cavity for the LED; and
a layer of solder on the second leadframe surface of the pads, leads, and fingers.
2. The proximity sensor of claim 1 wherein the fingers framing the first pad are designed to leave a gap between the finger tips for placing a lead.
3. The proximity sensor of claim 1 wherein the fingers framing the first pad are designed to encircle the first pad as well as the lead carrying the LED stitch bond.