Process for bonding two substrates
The invention relates to a method for bonding two substrates, in particular, two semiconductor substrates that, in order to be able to improve the reliability of the process, provides the step of providing a gaseous flow over the bonding surfaces of the substrates. The gaseous flow is preferably a laminar flow that is essentially parallel to the bonding surfaces of the substrates, and has a temperature in a range of from room temperature up to 100° C.
1. A method for reducing bonding defects when bonding two substrates to one another, which comprises, prior to bonding, providing a gaseous flow over bonding surfaces between the substrates until the substrates come into contact, wherein providing the gaseous flow comprises using a gas inflow device and a gas outflow device arranged and configured such that the gaseous flow is a laminar flow that is essentially parallel to the bonding surfaces of the substrates, and the gaseous flow has a temperature in a range of from room temperature up to 100° C.; and thereafter bonding the substrates together to reduce defects compared to bonding substrates without the prior gaseous flow over the bonding surfaces.
2. The method according to claim 1 , wherein the gaseous flow is provided during a heat treatment of the two substrates.
3. The method according to claim 2 , wherein the gaseous flow is heated such that the heat treatment is at least partially carried out using the heated gaseous flow.
4. The method according to claim 3 , wherein the heat treatment is completely carried out using the heated gaseous flow.
5. The method according to claim 1 , wherein the gaseous flow comprises a gas having a thermal conductivity of 10*10 −3 W/m.K.
6. The method according to claim 1 , wherein the gaseous flow comprises an inert gas.
7. The method according to claim 6 , wherein the inert gas is nitrogen or argon.
8. The method according to claim 1 , wherein the gaseous flow is provided in an oxidizing atmosphere.
9. The method according to claim 8 , wherein the oxidizing atmosphere is air or 20% oxygen in nitrogen.
10. The method according to claim 1 , wherein the gaseous flow is provided in a dry atmosphere or an atmosphere having a low humidity rate.
11. The method according to claim 1 , wherein the gaseous flow treatment is carried out over a time period of from several seconds up to several minutes.
12. The method according to claim 1 , wherein the substrates are semiconductor substrates.
13. A method for reducing bonding defects when bonding two semiconductor substrates to one another, which comprises, prior to bonding, providing a gaseous flow over bonding surfaces between the substrates until the substrates come into contact, wherein providing the gaseous flow comprises using a gas inflow device and a gas outflow device arranged and configured such that the gaseous flow is a laminar flow that is essentially parallel to the bonding surfaces of the substrates, the gaseous flow has a temperature in a range of from room temperature up to 100° C., and the gaseous flow treatment is carried out over a time period of from several seconds up to several minutes; and thereafter bonding the substrates together by bringing the substrates into close contact and locally applying a pressure to create a bonding front which spreads between the substrates with the gaseous flow stopped when the substrates touch each other to thereby reduce defects compared to bonding substrates without the prior gaseous flow over the bonding surfaces.
14. The method according to claim 13 , wherein the gaseous flow is provided during a heat treatment of the two substrates.
15. The method according to claim 13 , wherein the gaseous flow comprises an inert gas.
16. The method according to claim 13 , wherein the gaseous flow is provided in an oxidizing atmosphere.