Semiconductor device including gate electrode provided over active region in p-type nitride semiconductor layer and method of manufacturing the same, and power supply apparatus
A semiconductor device includes a nitride semiconductor stacked structure including a carrier transit layer and a carrier supply layer; a p-type nitride semiconductor layer provided over the nitride semiconductor stacked structure and including an active region and an inactive region; an n-type nitride semiconductor layer provided on the inactive region in the p-type nitride semiconductor layer; and a gate electrode provided over the active region in the p-type nitride semiconductor layer.
1. A semiconductor device comprising:
a nitride semiconductor stacked structure comprising a carrier transit layer and a carrier supply layer;
a p-type nitride semiconductor layer provided over the nitride semiconductor stacked structure and comprising an active region and an inactive region;
an n-type nitride semiconductor layer provided on the inactive region in the p-type nitride semiconductor layer; and
a gate electrode provided over the active region in the p-type nitride semiconductor layer;
wherein
the n-type nitride semiconductor layer is depleted, causing it to have fixed positive charges, and the fixed positive charges in the n-type nitride semiconductor layer cause a conduction band energy level at an interface between the carrier transit layer and the carrier supply layer to be comparable to that in a similar structure which lacks the p-type nitride semiconductor layer and the n-type nitride semiconductor layer.
2. The semiconductor device according to claim 1 , wherein the active region is a region having a fixed charge, and the inactive region is a region without a fixed charge.
3. The semiconductor device according to claim 1 , wherein the p-type nitride semiconductor layer and the n-type nitride semiconductor layer include a same nitride semiconductor material.
4. The semiconductor device according to claim 1 , wherein the p-type nitride semiconductor layer includes a GaN, AlN or InN crystal, or a mixed crystal thereof, and the n-type nitride semiconductor layer includes a GaN, AlN or InN crystal, or a mixed crystal thereof.
5. The semiconductor device according to claim 1 , wherein the p-type nitride semiconductor layer is a p-type GaN layer, and the n-type nitride semiconductor layer is an n-type GaN layer.
6. The semiconductor device according to claim 1 , wherein the active region in the p-type nitride semiconductor layer and the gate electrode Schottky-contact.
7. The semiconductor device according to claim 1 , further comprising a gate insulation film between the active region in the p-type nitride semiconductor layer and the gate electrode.
8. The semiconductor device according to claim 1 , wherein the nitride semiconductor stacked structure includes a GaN, AlN or InN crystal, or a mixed crystal thereof.
9. A semiconductor device comprising:
a stage mounting a semiconductor chip comprising: a nitride semiconductor stacked structure comprising a carrier transit layer and a carrier supply layer; a p-type nitride semiconductor layer provided over the nitride semiconductor stacked structure and comprising an active region and an inactive region; an n-type nitride semiconductor layer provided on the inactive region in the p-type nitride semiconductor layer; and a gate electrode provided over the active region in the p-type nitride semiconductor layer;
a gate lead connected to the gate pad in the semiconductor chip;
a source lead connected to the source pad in the semiconductor chip;
a drain lead connected to the drain pad in the semiconductor chip; and
an encapsulation resin;
wherein
the n-type nitride semiconductor layer is depleted, causing it to have fixed positive charges, and the fixed positive charges in the n-type nitride semiconductor layer cause a conduction band energy level at an interface between the carrier transit layer and the carrier supply layer to be comparable to that in a similar structure which lacks the p-type nitride semiconductor layer and the n-type nitride semiconductor layer.
10. The semiconductor device according to claim 9 , wherein the active region is a region having a fixed charge, and the inactive region is a region without a fixed charge.
11. The semiconductor device according to claim 9 , wherein the p-type nitride semiconductor layer and the n-type nitride semiconductor layer include a same nitride semiconductor material.
12. The semiconductor device according to claim 9 , wherein the p-type nitride semiconductor layer includes a GaN, AlN or InN crystal, or a mixed crystal thereof, and the n-type nitride semiconductor layer includes a GaN, AlN or InN crystal, or a mixed crystal thereof.
13. The semiconductor device according to claim 9 , wherein the p-type nitride semiconductor layer is a p-type GaN layer, and the n-type nitride semiconductor layer is an n-type GaN layer.
14. The semiconductor device according to claim 9 , wherein the active region in the p-type nitride semiconductor layer and the gate electrode Schottky-contact.
15. The semiconductor device according to claim 9 , further comprising a gate insulation film between the active region in the p-type nitride semiconductor layer and the gate electrode.
16. The semiconductor device according to claim 9 , wherein the nitride semiconductor stacked structure includes a GaN, AlN or InN crystal, or a mixed crystal thereof.
17. A power supply apparatus comprising:
a semiconductor device comprising:
a nitride semiconductor stacked structure comprising a carrier transit layer and a carrier supply layer;
a p-type nitride semiconductor layer provided over the nitride semiconductor stacked structure and comprising an active region and an inactive region;
an n-type nitride semiconductor layer provided on the inactive region in the p-type nitride semiconductor layer; and
a gate electrode provided over the active region in the p-type nitride semiconductor layer;
wherein
the n-type nitride semiconductor layer is depleted, causing it to have fixed positive charges, and the fixed positive charges in the n-type nitride semiconductor layer cause a conduction band energy level at an interface between the carrier transit layer and the carrier supply layer to be comparable to that in a similar structure which lacks the p-type nitride semiconductor layer and the n-type nitride semiconductor layer.
18. The semiconductor device according to claim 17 , wherein the active region is a region having a fixed charge, and the inactive region is a region without a fixed charge.
19. The semiconductor device according to claim 17 , wherein the p-type nitride semiconductor layer and the n-type nitride semiconductor layer include a same nitride semiconductor material.
20. The semiconductor device according to claim 17 , wherein the p-type nitride semiconductor layer includes a GaN, AlN or InN crystal, or a mixed crystal thereof, and the n-type nitride semiconductor layer includes a GaN, AlN or InN crystal, or a mixed crystal thereof.
21. The semiconductor device according to claim 17 , wherein the p-type nitride semiconductor layer is a p-type GaN layer, and the n-type nitride semiconductor layer is an n-type GaN layer.
22. The semiconductor device according to claim 17 , wherein the active region in the p-type nitride semiconductor layer and the gate electrode Schottky-contact.
23. The semiconductor device according to claim 17 , further comprising a gate insulation film between the active region in the p-type nitride semiconductor layer and the gate electrode.
24. The semiconductor device according to claim 17 , wherein the nitride semiconductor stacked structure includes a GaN, AN or InN crystal, or a mixed crystal thereof.