Method and apparatus for trimming the working layers of a double-side grinding apparatus
A trimming apparatus for trimming two working layers, including bonded abrasive applied on mutually facing sides of an upper and a lower working disk of a grinding apparatus configured for simultaneous double-side processing of flat workpieces includes a trimming disk, a plurality of trimming bodies and an outer toothing, where the trimming bodies are configured to release abrasive substances upon contract with the working layers so as to effect material removal from the working layers. At least 80% of the area of the trimming bodies configured to come into contact with the working layers is arranged within a ring-shaped region on the trimming disk. The width of the ring-shaped region is between 1-25% of the diameter of the trimming disk and the area of the trimming bodies which comes into contact with the working layers occupies 20-90% of the total area of the ring-shaped region.
1. A trimming apparatus for trimming two working layers including bonded abrasive applied on mutually facing sides of an upper and of a lower working disk of a grinding apparatus configured for the simultaneous double-side processing of flat workpieces, the apparatus comprising:
a trimming disk,
a plurality of trimming bodies; and
an outer toothing,
wherein the trimming bodies are configured to release abrasive substances upon contact with working layers so as to effect material removal from the working layers by loose grain, and
wherein the outer toothing is height-adjustable relative to the trimming disk.
2. A trimming apparatus for trimming two working layers including bonded abrasive applied on mutually facing sides of an upper and of a lower working disk of a grinding apparatus configured for the simultaneous double-side processing of flat workpieces, the apparatus comprising:
a trimming disk,
a plurality of trimming bodies; and
an outer toothing,
wherein the trimming bodies are configured to release abrasive substances upon contact with the working layers so as to effect material removal from the working layers by loose grain,
wherein at least 80% of an area of the trimming bodies configured to come into contact with the working layers is arranged within a ring-shaped region on the trimming disk,
wherein a width of said ring-shaped region is between 1% and 25% of a diameter of the trimming disk, and
wherein the area of the trimming bodies which come into contact with the working layers occupies 20% to 90% of a total area of the ring-shaped region.