IP Library Granted Patent US 9,011,570
Granted Patent B2
US 9,011,570 · App. 13/079,757 · Granted Apr 21, 2015

Articles containing copper nanoparticles and methods for production and use thereof

Inventors: Peter V. Bedworth (Palo Alto, CA); Alfred A. Zinn (Palo Alto, CA)
Assignee: Lockheed Martin Corporation
C09K5/14H01L24/29C22C9/00H01L2924/15747H01L2224/838B22F1/0018
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Quick Facts
Patent No.
US 9,011,570
App. No.
13/079,757
Granted
Apr 21, 2015
Kind
B2
Abstract

Articles containing a matrix material and plurality of copper nanoparticles in the matrix material that have been at least partially fused together are described. The copper nanoparticles are less than about 20 nm in size. Copper nanoparticles of this size become fused together at temperatures and pressures that are much lower than that of bulk copper. In general, the fusion temperatures decrease with increasing applied pressure and lowering of the size of the copper nanoparticles. The size of the copper nanoparticles can be varied by adjusting reaction conditions including, for example, surfactant systems, addition rates, and temperatures. Copper nanoparticles that have been at least partially fused together can form a thermally conductive percolation pathway in the matrix material.

Claims (26)

1. A method comprising:

providing a plurality of copper nanoparticles that are mixed with a matrix material to form a paste;

wherein the plurality of copper nanoparticles are less than about 20 nm in size and further comprise a surfactant system comprising a bidentate diamine and one or more C6-C18 alkylamines;

placing the paste in a joint between a first member and a second member; and

joining the first member to the second member by at least partially fusing the plurality of copper nanoparticles together;

wherein the copper nanoparticles are present as a thermally conductive percolation pathway within the matrix material upon being at least partially fused together.

2. The method of claim 1 , wherein the plurality of copper nanoparticles are sufficiently porous to allow for rework of the joint after being at least partially fused together.

3. The method of claim 2 , wherein the plurality of copper nanoparticles are up to about 25% porous after being at least partially fused together.

4. The method of claim 1 , wherein a strength to failure joining the first member and the second member is at least about 4400 psi.

5. The method of claim 1 , wherein the matrix material is selected from the group consisting of a polymer matrix, a rubber matrix, a glass matrix, a ceramic matrix and a metal matrix.

6. The method of claim 1 , wherein the copper nanoparticles are at least partially fused together by applying heat.

7. The method of claim 1 , wherein the copper nanoparticles are at least partially fused together by applying pressure.

8. The method of claim 1 , wherein the bidentate diamine comprises an N,N′-dialkylethylenediamine.

9. The method of claim 1 , wherein the paste contains the copper nanoparticles in an amount of about 50% or higher by weight.

10. A method comprising:

providing a plurality of copper nanoparticles that are mixed with a matrix material to form a paste:

wherein the plurality of copper nanoparticles are less than about 20 nm in size and further comprise a surfactant system comprising a bidentate diamine and one or more C6-C18 alkylamines;

placing the paste in a joint between a first member and a second member; and

joining the first member to the second member by at least partially fusing the plurality of copper nanoparticles together.

11. The method of claim 10 , wherein the matrix material is selected from the group consisting of a polymer matrix, a rubber matrix, a glass matrix, a ceramic matrix and a metal matrix.

12. The method of claim 10 , wherein the copper nanoparticles are at least partially fused together by applying heat.

13. The method of claim 10 , wherein the copper nanoparticles are at least partially fused together by applying pressure.

14. The method of claim 10 , wherein the paste contains the copper nanoparticles in an amount of about 50% or higher by weight.

15. The method of claim 10 , wherein the N,N′-dialkylethylenediamine comprises N,N′-di-t-butylethylenediamine.

16. The method of claim 10 , further comprising:

removing the matrix material after at least partially fusing the copper nanoparticles together.

Assignments (2)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 18, 2019
From: LOCKHEED MARTIN CORPORATION
To: KUPRION INC.
Reel/Frame 050412/0900 →
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Apr 11, 2011
From: BEDWORTH, PETER V.; ZINN, ALFRED A.
To: LOCKHEED MARTIN CORPORATION
Reel/Frame 026107/0695 →
Continuity (1)
Related Publication 20120251381A1 · Oct 4, 2012