Method for conformal treatment of dielectric films using inductively coupled plasma
Disclosed are apparatus and methods for processing a substrate. The substrate having a feature with a layer thereon is exposed to an inductively coupled plasma which forms a substantially conformal layer.
1. A method of forming a film, the method comprising:
placing a substrate on a substrate support of a processing chamber, the substrate having a first layer thereon comprising a structure including at least one sidewall, the substrate having a film comprising an oxide deposited on the at least one sidewall of the structure; and
exposing the film to an inductively coupled plasma formed from a process gas comprising one or more of oxygen and an oxygen-containing gas and oxygen-inert gas mixture to form a substantially conformal film.
2. The method of claim 1 , wherein the film comprises a nitride film.
3. The method of claim 2 , wherein the process gas comprises one or more of nitrogen and a nitrogen-containing compound and nitrogen-inert gas mixture.
4. The method of claim 1 , wherein the film has a thickness less than about 300 Å.
5. The method of claim 1 , further comprising depositing the film on the substrate.
6. The method of claim 5 , wherein the film is deposited by one or more of an atomic layer deposition process and a chemical vapor deposition process.
7. The method of claim 5 , wherein the film has a thickness less than about 300 Å.
8. The method of claim 5 , wherein depositing the film on the substrate and exposing the substrate to the inductively coupled plasma occurs in a single processing chamber.
9. The method of claim 5 , wherein the film is deposited in a first chamber and the method further comprises moving the substrate from the first chamber to a second chamber before exposing the film to the inductively coupled plasma.
10. The method of claim 9 , wherein the substrate is not exposed to ambient conditions during movement from the first chamber to the second chamber.
11. The method of claim 1 , further comprising heating the substrate to a temperature less than about 600° C.
12. The method of claim 1 , further comprising biasing substrate with DC or AC power.
13. A method of forming a film, the method comprising:
(a) placing a substrate having a first layer thereon on a substrate support of a first processing chamber, the first layer including a structure with at least one sidewall;
(b) depositing a film on the substrate in the first chamber so that the film covers at least one sidewall of the structure, the film having a thickness less than about 300 Å;
(c) exposing the film to an inductively coupled plasma formed from a process gas to form a substantially conformal film on the at least one sidewall; and
(d) repeating (b) and (c) until a film of desired thickness is formed, the film on the at least one sidewall being substantially conformal.
14. The method of claim 13 , wherein depositing the film on the substrate is performed by atomic layer deposition and the film has a thickness of about one monolayer before exposure to the inductively coupled plasma.
15. The method of claim 13 , further comprising heating the substrate to temperatures less than about 600° C. during (b) and (c).
16. The method of claim 13 , wherein the process gas comprises one or more of nitrogen, oxygen, a nitrogen-containing compound and an oxygen-containing compound.
17. The method of claim 13 , further comprising moving the substrate from the first chamber to a second chamber before exposure to the inductively coupled plasma.
18. A method of forming a film, the method comprising repeating sequentially depositing a film having a thickness less than about 300 Å on at least a sidewall of a structure on a surface of a substrate and exposing the film on at least the sidewall to an inductively coupled plasma to form a substantially conformal layer on the sidewall.