Pipe assembly for district heating network
A pipe assembly for a district heating network, comprising a first pipe, a second pipe and, surrounding the first pipe, a first insulating layer arranged to reduce heat transfer from the first pipe outwards in a radial direction, the first pipe being arranged for a first heat transfer medium flow and the second pipe being arranged for a second heat transfer medium flow. The pipe assembly comprises a heat transfer device arranged to transfer heat from an outer surface of the first insulating layer to the second pipe, and a second insulating layer arranged to reduce heat transfer from the heat transfer device and the second pipe outwards in the radial direction, the thermal conductivity of the heat transfer device being substantially better than the thermal conductivity of the first insulating layer and the thermal conductivity of the second insulating layer.
1. A pipe assembly for a district heating network, comprising a first pipe, a second pipe, a heat transfer device and, surrounding the first pipe, a first insulating layer that is arranged to reduce heat transfer from the first pipe outwards in a radial direction, the first pipe being arranged for a first heat transfer medium flow, the second pipe being located outside the first insulating layer in radial direction and arranged for a second heat transfer medium flow, and the heat transfer device being arranged to transfer heat from an outer surface of the first insulating layer to the second pipe, wherein the pipe assembly further comprises a second insulating layer arranged to reduce heat transfer from the heat transfer device and the second pipe outwards in the radial direction, wherein the thermal conductivity of the heat transfer device is at least one thousand times the thermal conductivity of the first insulating layer.
2. A pipe assembly as claimed in claim 1 , wherein the heat transfer device comprises one or more of the following: plate member, mesh member, material layer.
3. A pipe assembly as claimed in claim 2 , wherein the heat transfer device has a cross-section of substantially the shape of a figure eight, and is situated such that the first loop of the figure eight is in contact with the outer surface of the first insulating layer while the second loop of the figure eight is in contact with an outer surface of the second pipe.
4. A pipe assembly as claimed in claim 1 , wherein the thermal conductivity of the heat transfer device is at least three times the thermal conductivity of the material of the first pipe and at least three times the thermal conductivity of the material of the second pipe.
5. A pipe assembly as claimed in claim 1 , wherein both the first pipe and the second pipe are arranged for a flow of liquid water.
6. A pipe assembly as claimed in claim 1 , wherein both the first pipe and the second pipe are steel pipes.
7. A pipe assembly as claimed in claim 1 , wherein both the first insulating layer and the second insulating layer comprise polyurethane.
8. A pipe assembly as claimed in claim 1 , wherein the pipe assembly comprises an outer pipe which surrounds the first pipe, the second pipe, the first insulating layer, the heat transfer device, and the second insulating layer.
9. A pipe assembly for a district heating network that has:
a first pipe;
a first insulating layer that surrounds the first pipe and is arranged to reduce heat transfer from the first pipe outwards in a radial direction;
a second pipe that is located radially outside the first insulating layer and is arranged for a second heat transfer medium flow;
a heat transfer device that is arranged to transfer heat from an outer surface of the first insulating layer to the second pipe; and
a second insulating layer that is arranged to reduce heat transfer from the heat transfer device and the second pipe outwards in the radial direction;
wherein the thermal conductivity of the heat transfer device is at least one thousand times the thermal conductivity of the second insulating layer.
10. A pipe assembly as claimed in claim 9 , in which the thermal conductivity of the heat transfer device is also at least one thousand times greater than the thermal conductivity of the first insulating layer.