Method for forming interposers and stacked memory devices
Methods for forming a stacking interposer are provided that create a more compact and/or reliable interposer cavity. According to one method, a segmentation process that partially cuts a multi-cell, multi-layer PCB panel to a controlled depth along the internal walls/edges of a cavity region with each of the interposer cell sites defined within the PCB panel is used. The material within the cavity region is then removed (by routing) to a controlled depth to form the internal cavity for each interposer cell site. Pillars may then be removed from the PCB panel. As a result of the initial partial cuts of the internal walls of the cavity region, the corners of the cavities may have a square configuration for fitting over the top of a BGA/memory device (which has very square corners).
1. A method of manufacturing a stacking interposer, comprising:
forming a multi-cell, multilayer printed circuit board panel having a plurality of interposer cell sites;
slotting the panel using a diamond saw process to form inner walls of cell cavities;
forming a cavity at each interposer cell site on the panel using the diamond saw process, the inner corners of each cavity having a square configuration;
removing remaining material left behind by slotting process; and
cutting outer interposer walls using the diamond saw process.
2. The method of claim 1 , wherein the inner walls of the cell cavities are cut to a controlled depth.
3. The method of claim 2 , wherein the controlled depth is less than the thickness of the panel resulting in partial cuts into the panel to form the inner wall of the cell cavities.
4. The method of claim 1 , wherein the remaining material is removed using a router bit.
5. The method of claim 1 , wherein the stacking interposer is placed over a first ball grid array dynamic random access memory (DRAM) device and coupled to a dual in-line memory module (DIMM) printed circuit board.
6. The method of claim 5 , wherein a second ball grid array dynamic random access memory (DRAM) device is coupled to a top surface of the stacking interposer.
7. The method of claim 5 , wherein the first ball grid array dynamic random access memory (DRAM) device is received in the cavity of the stacking interposer.
8. The method of claim 7 , wherein a gap is formed between the stacking interposer and the first ball grid array dynamic random access memory (DRAM) device.
9. A method of manufacturing a stacking interposer, comprising:
forming a multi-cell, multilayer printed circuit board panel having a plurality of interposer cell sites;
forming a cavity at each interposer cell site on the panel using a router process;
cutting inner cavity walls and outer cavity walls of the each interposer cell site using a single diamond saw process; and
removing remaining material left behind when forming the cavity at the each interposer cell site.
10. The method of claim 9 , wherein the inner cavity walls and outer cavity walls are cut to a controlled depth.
11. The method of claim 10 , wherein the controlled depth is less than the thickness of the panel resulting in partial cuts into the panel to form the inner cavity walls and outer cavity walls.
12. The method of claim 9 , wherein the remaining material is removed using a router bit.
13. The method of claim 9 , wherein the stacking interposer is placed over a first ball grid array dynamic random access memory (DRAM) device and coupled to a dual in-line memory module (DIMM) printed circuit board.
14. The method of claim 13 , wherein a second ball grid array dynamic random access memory (DRAM) device is coupled to a top surface of the stacking interposer.
15. The method of claim 13 , wherein the first ball grid array dynamic random access memory (DRAM) device is received in the cavity of the stacking interposer.
16. The method of claim 15 , wherein a gap is formed between the stacking interposer and the first ball grid array dynamic random access memory (DRAM) device.