Stepped package for image sensor and method of making same
An image sensor package includes a crystalline handler having opposing first and second surfaces, and a cavity formed into the first surface. At least one step extends from a sidewall of the cavity, wherein the cavity terminates in an aperture at the second surface. A cover is mounted to the second surface and extends over and covers the aperture. The cover is optically transparent to at least one range of light wavelengths. A sensor chip is disposed in the cavity and mounted to the at least one step. The sensor chip includes a substrate with front and back opposing surfaces, a plurality of photo detectors formed at the front surface, and a plurality of contact pads formed at the front surface which are electrically coupled to the photo detectors.
1. An image sensor package, comprising:
a crystalline handler having opposing first and second surfaces, the handler including a cavity formed into the first surface and at least one step extending from a sidewall of the cavity, wherein the cavity terminates in an aperture at the second surface;
a cover mounted to the second surface and extending over and covering the aperture, wherein the cover is optically transparent to at least one range of light wavelengths;
a sensor chip disposed in the cavity, wherein the sensor chip includes:
a substrate with front and back opposing surfaces,
a plurality of photo detectors formed at the front surface, and
a plurality of contact pads formed at the front surface which are electrically coupled to the photo detectors,
wherein the front surface of the sensor chip is mounted to the at least one step;
a plurality of electrically conductive traces each formed on and insulated from a surface of the at least one step, a surface of the sidewall of the cavity, and the first surface; and
a plurality of electrical connectors disposed between the substrate front surface and the at least one step, wherein each of the electrical connectors is electrically connected between one of the traces and one of the contact pads.
2. The image sensor package of claim 1 , further comprising:
dielectric material disposed in the cavity and encapsulating the sensor chip in the cavity.