Conductive resin composition, multilayer ceramic capacitor having the same, and method of manufacturing the multilayer ceramic capacitor

1. A conductive resin composition, comprising:

10 to 50 wt % of a gel type silicone rubber such as polydimethylsiloxane (PDMS); and

50 to 90 wt % of conductive metal powder particles.

2. The conductive resin composition of claim 1 , wherein the conductive resin composition has viscosity of 8,000 to 50,000 cPs.

3. The conductive resin composition of claim 1 , wherein the conductive metal powder particles include at least one of copper (Cu), silver (Ag), and copper coated with silver thereon.

4. A multilayer ceramic capacitor, comprising:

a ceramic body having a plurality of laminated dielectric layers therein;

a plurality of first and second internal electrodes formed on at least one surface of the dielectric layers, and alternately exposed to both end surfaces of the ceramic body;

first and second external electrodes formed on both end surfaces of the ceramic body, respectively, and electrically connected to the first and second internal electrodes, respectively;

first and second conductive resin layers formed on surfaces of the first and second external electrodes, respectively, the first and second conductive resin layers being formed of a conductive resin composition including 10 to 50 wt % of a gel type silicone rubber such as polydimethylsiloxane (PDMS) and 50 to 90 wt % of conductive metal powder particles; and

first and second plating layers formed on surfaces of the first and second conductive resin layers, respectively.

5. The multilayer ceramic capacitor of claim 4 , wherein the conductive resin composition has viscosity of 8,000 to 50,000 cPs.

6. The multilayer ceramic capacitor of claim 4 , wherein the conductive metal powder particles include at least one of copper (Cu), silver (Ag), and copper coated with silver thereon.

7. The multilayer ceramic capacitor of claim 4 , wherein in the first and second conductive resin layers, a ratio of thickness of a part corresponding to a center portion of the ceramic body to thickness of a part corresponding to a corner portion of the ceramic body satisfies a range of 1˜5:1.

8. The multilayer ceramic capacitor of claim 4 , wherein the first and second plating layers respectively include a nickel (Ni) plating layer formed on the surface of the first and second conductive resin layers, respectively, and a tin (Sn) plating layer formed on a surface of the nickel plating layer.

9. A method of manufacturing a multilayer ceramic capacitor, the method comprising:

preparing a plurality of ceramic sheets;

forming first and second internal electrodes on at least one surface of the ceramic sheets, respectively;

laminating the plurality of ceramic sheets having the first and second internal electrodes formed thereon to form a laminate;

cutting the laminate such that one end of the first and second internal electrodes are alternately exposed to both end surfaces of the laminate, respectively;

firing the cut laminate to form a ceramic body having the plurality of first and second internal electrodes;

forming first and second external electrodes of a conductive paste on both end surfaces of the ceramic body to thereby allow the first and second external electrodes to be electrically connected to exposed portions of the first and second internal electrodes, respectively;

forming first and second conductive resin layers of a conductive resin paste on surfaces of the first and second external electrodes, the conductive resin paste including 10 to 50 wt % of a gel type silicone rubber such as polydimethylsiloxane (PDMS) and 50 to 90 wt % of conductive metal powder particles; and

plating surfaces of the first and second conductive resin layers.

10. The method of claim 9 , wherein in the forming of the first and second conductive resin layers, the conductive resin paste has viscosity of 8,000 to 50,000 cPs.

11. The method of claim 9 , wherein in the forming of the first and second conductive resin layers, conductive metal powder particles of the conductive resin paste include at least one of copper (Cu), silver (Ag), and copper coated with silver thereon.

12. The method of claim 9 , wherein in the forming of the first and second conductive resin layers, a ratio of thickness of respective parts corresponding to both end surfaces of the ceramic body and a thickness of a part corresponding to a corner portion of the ceramic body satisfies a range of 1˜5:1.

13. The method of claim 9 , wherein in the plating of the surfaces of the first and second conductive resin layers, a nickel (Ni) plating layer is formed on the surfaces of the first and second conductive resin layers and then a tin (Sn) plating layer is formed on a surface of the nickel plating layer.