Clathrate, curing agent, cure accelerator, epoxy resin composition, and epoxy resin composition for encapsulation of semiconductor
It is an object of the present invention to provide a clathrate that suppresses a curing reaction at low temperature to promote an improvement in storage stability (one-component stability), and can effectively cure a resin by heating treatment. A clathrate suitable for the clathrate is a clathrate containing (b1) at least one selected from the group consisting of an aliphatic polyvalent carboxylic acid, 5-nitroisophthalic acid, 5-tert-butylisophthalic acid, 5-hydroxyisophthalic acid, isophthalic acid, and benzophenone-4,4′-dicarboxylic acid; and (b2) at least one selected from the group consisting of an imidazole compound represented by the following formula (I), and 1,8-diazabicyclo[5.4.0]undecene-7, at a molar ratio of 1:1.
1. A clathrate containing:
(b1) at least one selected from the group consisting of
5-nitroisophthalic acid,
5-tert-butylisophthalic acid,
and
benzophenone-4,4′-dicarboxylic acid; and
(b2) 1,8-diazabicyclo[5.4.0]undecene-7,
at a molar ratio of 1:1.
2. A curing agent or a cure accelerator for a solid epoxy resin composition, containing a clathrate containing:
(b1) at least one selected from the group consisting of
5-nitroisophthalic acid,
5-tert-butylisophthalic acid,
and
benzophenone-4,4′-dicarboxylic acid; and
(b2) 1,8-diazabicyclo[5.4.0]undecene-7,
at a molar ratio of 1:1.