IP Library › Granted Patent US 9,024,348
Granted Patent B2
US 9,024,348 · App. 13/921,050 · Granted May 5, 2015

Light-emitting device including LED chip and a case having resin and glass fiber

Inventors: Masakata Koseki (Kiyosu, JP); Makoto Sato (Kiyosu, JP)
Assignee: Toyoda Gosei Co., Ltd.
H01L33/56H01L33/486H01L33/60H01L2924/0002
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Quick Facts
Patent No.
US 9,024,348
App. No.
13/921,050
Granted
May 5, 2015
Kind
B2
Abstract

A light-emitting device includes an LED chip, and a case including a sidewall portion that surrounds the LED chip so as to reflect a light emitted from the LED chip. The case further includes a resin that includes a glass fiber and is integrally formed by injection molding. An average length of the glass fiber is greater than a thickness of the sidewall portion. The resin has a refractive index different from the glass fiber.

Claims (30)

1. A light-emitting device, comprising:

an LED chip; and

a case comprising a sidewall portion that surrounds the LED chip so as to reflect a light emitted from the LED chip,

wherein the case further comprises a resin that comprises a glass fiber and is integrally formed by injection molding,

wherein an average length of the glass fiber is greater than a thickness of the sidewall portion,

wherein the resin has a refractive index different from the glass fiber, and

wherein a ratio of the thickness of the sidewall portion to the average length of the glass fiber is in a range of 0.36 to 0.57.

2. The light-emitting device according to claim 1 , wherein the thickness of the sidewall portion is not less than 65 μm and not more than 105 μm, and

wherein the average length of the glass fiber is not less than 230 μm and not more than a short side of the case in a top view.

3. The light-emitting device according to claim 1 , further comprising a side-view type light-emitting device.

4. The light-emitting device according to claim 1 , wherein the resin comprises one of a polyphthalamide resin, LCP, PCT, a silicone-based resin and an epoxy-based resin, and wherein the glass fiber has a refractive index less than 1.45.

5. The light-emitting device according to claim 1 , wherein the resin comprises a fluorine resin, and

wherein the glass fiber has a refractive index more than 1.4.

6. The light-emitting device according to claim 1 , further comprising:

a sealing material to seal the LED chip,

wherein an upper surface of the sealing material substantially corresponds to a top of the sidewall portion.

7. The light-emitting device according to claim 1 , wherein the case further comprises:

a bottom wall portion disposed below the LED chip and the sidewall portion; and

a gate portion which is an impression of a gate of a mold used for injection molding,

wherein the sidewall portion, the bottom wall portion, and the gate portion integrally form the case.

8. The light-emitting device according to claim 1 , wherein the sidewall portion has a thickness decreasing from a bottom to a top of the sidewall portion.

9. The light-emitting device according to claim 1 , wherein the sidewall portion has a thickness which is uniform from a bottom to a top of the sidewall portion.

10. The light-emitting device according to claim 1 , wherein the glass fiber has a columnar shape with a diameter not less than 6 μm and not more than 13 μm.

11. The light-emitting device according to claim 1 , wherein a content of the glass fiber in the case is not less than 1 mass % and not more than 40 mass %.

12. The light-emitting device according to claim 7 , wherein the bottom wall portion of the case is disposed so as to be substantially perpendicular to a mounting surface of the light-emitting device.

13. The light-emitting device according to claim 1 , wherein a thickness of the sidewall portion is set in relation to a luminous flux of the light-emitting device such that the luminous flux of the light-emitting device is 95% or greater.

14. The light-emitting device according to claim 1 , wherein the glass fiber is arranged at an angle substantially parallel to a surface direction of the sidewall portion.

15. The light-emitting device according to claim 1 , wherein the average length of the glass fiber is greater than a thickest portion of the sidewall portion.

16. The light-emitting device according to claim 1 , wherein the average length of the glass fibers is greater than the thickness of the sidewall portion thereby improving a light extraction efficiency of the device.

17. The light-emitting device according to claim 1 , wherein injection molding introduces a raw material of the glass fiber into a resin extruder from a side feeder, in order to reduce a force applied to the raw material, thereby suppressing a decrease in the average length of the glass fiber.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Jun 19, 2013
From: KOSEKI, MASAKATA; SATO, MAKOTO
To: TOYODA GOSEI CO., LTD.
Reel/Frame 030715/0934 →
Priority Claims (1)
JP 2012-156798 · Jul 12, 2012 · national
Continuity (1)
Related Publication 20140014993A1 · Jan 16, 2014