Semiconductor device and method of manufacturing the same

1. A semiconductor device comprising:

a chip comprising a first MOSFET formed in a first region, and a second MOSFET formed in a second region;

a common drain electrode of the first MOSFET and the second MOSFET, which is formed on a back surface of the chip;

a first source terminal and a first gate terminal of the first MOSFET, which are formed on a surface of the chip in the first region;

a second source terminal and a second gate terminal of the second MOSFET, which are formed at the surface of the chip in the second region, and which are arranged so as to be aligned substantially parallel to a direction in which the first source terminal and the first gate terminal are aligned;

a diode that is arranged between the first source terminal and the second source terminal; and

a first terminal and a second terminal of the diode, which are arranged so as to be aligned in a first direction substantially parallel to the direction in which the first source terminal and the first gate terminal are aligned, or in a second direction substantially perpendicular thereto.

2. The semiconductor device according to claim 1 ,

wherein when a direction in which the first terminal and the second terminal are aligned is the first direction, the first terminal and the second terminal are formed between the first region and the second region.

3. The semiconductor device according to claim 2 ,

wherein the diode is formed at a lower portion of the first terminal.

4. The semiconductor device according to claim 2 ,

wherein the diode is formed to be divided into the lower portion of the first terminal and a lower portion of the second terminal.

5. The semiconductor device according to claim 2 ,

wherein the first source terminal and the second source terminal are arranged facing each other while sandwiching a boundary of the first region and the second region,

wherein the first gate terminal and the second gate terminal are arranged facing each other while sandwiching the boundary of the first region and the second region,

wherein the first terminal is formed between the first source terminal and the second source terminal, and

wherein the second terminal is formed between the first gate terminal and the second gate terminal.

6. The semiconductor device according to claim 5 ,

wherein a distance between the first source terminal and the first terminal, and a distance between the second source terminal and the first terminal are substantially equal to each other, and

wherein a distance between the first gate terminal and the second terminal, and a distance between the second gate terminal and the second terminal are substantially equal to each other.

7. The semiconductor device according to claim 6 ,

wherein a distance between the first source terminal and the first gate terminal, a distance between the second source terminal and the second gate terminal, and a distance between the first terminal and the second terminal are substantially equal to one another.

8. The semiconductor device according to claim 2 , further comprising a protection diode coupled in parallel with the diode and coupled with opposing polarities.

9. The semiconductor device according to claim 8 ,

wherein the diode is formed at a lower portion of the first terminal, and

wherein the protection diode is formed at a lower portion of the second terminal.

10. The semiconductor device according to claim 1 ,

wherein when a direction in which the first terminal and the second terminal are aligned is the second direction,

the diode is formed between the first region and the second region, and

the first terminal is formed over the first region, and the second terminal is formed over the second region.

11. The semiconductor device according to claim 10 ,

wherein the first terminal is arranged so as to be sandwiched between the first source terminal and the first gate terminal, and

wherein the second terminal is arranged so as to be sandwiched between the second source terminal and the second gate terminal.

12. The semiconductor device according to claim 1 ,

wherein the first source terminal and the second gate terminal are arranged facing each other while sandwiching a boundary of the first region and the second region,

wherein the first gate terminal and the second source terminal are arranged facing each other while sandwiching the boundary of the first region and the second region, and

wherein the diode is arranged between the first region and the second region.

13. The semiconductor device according to claim 1 ,

wherein the diode is concentrically configured, with the first terminal being as a center.

14. The semiconductor device according to claim 13 ,

wherein the diode comprises:

a plurality of connection structures including a first conductive type semiconductor layer and a second conductive type semiconductor layer; and

a plurality of contact metals formed between adjacent connection structures, for forming the diode.

15. The semiconductor device according to claim 14 ,

wherein the first conductive type semiconductor layer comprising:

a first impurity concentration region formed on a second conductive type semiconductor layer side; and

a second impurity concentration region that is formed on a contact side, and that has a higher impurity concentration than in the first impurity concentration region.

16. The semiconductor device according to claim 14 ,

wherein a contact metal from among the plurality of contact metals has a height substantially equal to that of the first conductive type semiconductor layer and the second conductive type semiconductor layer.

17. The semiconductor device according to claim 1 ,

wherein a bidirectional Zener diode is provided between gates and sources of the first MOSFET and the second MOSFET, respectively.

18. A method of manufacturing a semiconductor device, the method comprising:

forming a first MOSFET in a first region of a chip, and forming a second MOSFET in a second region thereof;

forming a common drain electrode of the first MOSFET and the second MOSFET, on a back surface of the chip;

arranging a first source terminal and a first gate terminal of the first MOSFET, on a surface of the chip in the first region;

arranging a second source terminal and a second gate terminal of the second MOSFET, on the surface of the chip in the second region, so as to be aligned substantially parallel to a direction in which the first source terminal and the first gate terminal are aligned;

arranging a diode between the first source terminal and the second source terminal; and

arranging a first terminal and a second terminal of the diode so as to be aligned in a first direction substantially parallel to a direction in which the first source terminal and the first gate terminal are aligned, or in a second direction substantially perpendicular thereto.

19. The method of manufacturing the semiconductor device according to claim 18 , the method further comprising:

forming, along with formation of the diode, a protection diode coupled in parallel with the diode and in a direction opposite thereto, between the first MOSFET and the second MOSFET.

20. The method of manufacturing the semiconductor device according to claim 18 , the method further comprising:

forming, along with formation of the diode, a bidirectional Zener diode, between gates and sources of the first MOSFET and the second MOSFET, respectively.