IP Library › Granted Patent US 9,036,441
Granted Patent B2
US 9,036,441 · App. 13/793,457 · Granted May 19, 2015

Anti-fuse circuit in which anti-fuse cell data is monitored, and semiconductor device including the same

Inventors: Jong-Min Oh (Seoul, KR); Ho-Young Song (Hwaseong-si, KR); Seong-Jin Jang (Seongnam-si, KR)
Assignee: SAMSUNG ELECTRONICS CO., LTD.
G11C17/16G11C29/76
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Quick Facts
Patent No.
US 9,036,441
App. No.
13/793,457
Granted
May 19, 2015
Kind
B2
Abstract

An anti-fuse circuit in which anti-fuse program data may be monitored outside of the anti-fuse circuit and a semiconductor device including the anti-fuse circuit are disclosed. The anti-fuse circuit includes an anti-fuse array, a data storage circuit, and a first selecting circuit. The anti-fuse array includes one or more anti-fuse blocks including a first anti-fuse block having a plurality of anti-fuse cells and the anti-fuse array is configured to store anti-fuse program data. The data storage circuit is configured to receive and store the anti-fuse program data from the anti-fuse array through one or more data buses. The first selecting circuit is configured to output anti-fuse program data of a selected anti-fuse block of the one or more anti-fuse blocks in response to a first selection signal.

Claims (35)

1. An anti-fuse circuit, comprising:

an anti-fuse array including one or more anti-fuse blocks including a first anti-fuse block having a plurality of anti-fuse cells, the anti-fuse array configured to store anti-fuse program data;

a data storage circuit configured to receive and store the anti-fuse program data from the anti-fuse array through one or more data buses; and

a first selecting circuit configured to output anti-fuse program data of a selected anti-fuse block of the one or more anti-fuse blocks in response to a first selection signal,

wherein the anti-fuse program data is configured to be monitored outside of the anti-fuse circuit while the anti-fuse program data is transmitted from the anti-fuse array to the data storage circuit.

2. The anti-fuse circuit according to claim 1 , wherein the first selecting circuit is configured to output selected anti-fuse program data of the selected anti-fuse block through an output pad.

3. The anti-fuse circuit according to claim 1 , wherein the first selection signal is generated based on a test mode command.

4. The anti-fuse circuit according to claim 3 , wherein the anti-fuse circuit is configured to select an anti-fuse block to be tested, and sequentially output data of anti-fuse cells included in the selected anti-fuse block once the test mode command is applied.

5. The anti-fuse circuit according to claim 4 , wherein the anti-fuse circuit is configured to be used for repairing defective cells of a semiconductor memory device.

6. The anti-fuse circuit according to claim 5 , wherein the anti-fuse circuit is configured to apply the test mode command after all of the data of anti-fuse cells included in the selected anti-fuse block to be tested is transmitted to the data storage circuit.

7. The anti-fuse circuit according to claim 1 , wherein the anti-fuse array includes a test-mode anti-fuse block configured to be used to set a test-mode register set signal (TMRS).

8. The anti-fuse circuit according to claim 1 , wherein the anti-fuse array includes a row anti-fuse block configured to be used to substitute a defective word line of a memory cell array of a semiconductor memory device with a spare word line.

9. The anti-fuse circuit according to claim 1 , wherein the anti-fuse array includes a column anti-fuse block configured to be used to substitute a defective column selecting line of a memory cell array of a semiconductor memory device with a spare column selecting line.

10. The anti-fuse circuit according to claim 1 , wherein the data storage circuit includes registers configured to store anti-fuse program data received from the one or more anti-fuse blocks.

11. The anti-fuse circuit according to claim 1 , wherein the anti-fuse circuit further comprises:

a second selecting circuit configured to select one of at least one characteristics test data and the selected anti-fuse program data in response to a second selection signal.

12. The anti-fuse circuit according to claim 11 , wherein the characteristics test data includes characteristic test data of a charge sharing margin.

13. A semiconductor memory device, comprising:

a memory cell array having a normal memory cell array connected to word lines and column selecting lines, and a spare memory cell array connected to spare word lines and spare column selecting lines;

an anti-fuse array including one or more anti-fuse blocks each having a plurality of anti-fuse cells, the anti-fuse array configured to store anti-fuse program data;

a selecting circuit configured to select anti-fuse program data of an anti-fuse block of the one or more anti-fuse blocks, and to output the selected anti-fuse program data at an output pad of the semiconductor memory device in response to a first selection signal generated based on a test mode command, when the anti-fuse program data is read from each of anti-fuse blocks through data buses;

a column decoder configured to decode column address signals to generate column selection signals, and to provide the column selection signals to the column selecting lines; and

a spare column decoder configured to decode the column address signals to generate spare column selection signals based on the anti-fuse program data, and to provide the spare column selection signals to the spare column selecting lines when a defect is generated in at least one column selecting line of the column selecting lines; and

a data storage circuit configured to receive and store the anti-fuse program data from the anti-fuse array through one or more data buses,

wherein the selected anti-fuse program data is output at the output pad while the anti-fuse program data is being transmitted to the data storage circuit.

14. The semiconductor memory device according to claim 13 , wherein the semiconductor memory device is a stacked memory device in which a plurality of chips communicate data and control signals by a through-silicon-via (TSV).

15. A method of reading anti-fuse program data of a semiconductor device including an anti-fuse array, the method comprising:

transmitting anti-fuse program data from one or more anti-fuse blocks of the anti-fuse array to a data storage circuit through one or more data buses;

storing the anti-fuse program data into the data storage circuit;

selecting anti-fuse program data of one of the anti-fuse blocks; and

outputting the selected anti-fuse program data at an output pad in response to a selecting signal,

wherein outputting the selected anti-fuse program data at the output pad occurs while the selected anti-fuse program data is being transmitted to the data storage circuit.

16. The method according to claim 15 , wherein transmitting the anti-fuse program data includes selecting one of the anti-fuse blocks.

17. The method according to claim 15 , wherein the selecting signal is generated based on a test mode command signal.

18. The method according to claim 15 , wherein outputting the selected anti-fuse program data includes sequentially outputting all program data of the selected anti-fuse block.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Mar 11, 2013
From: OH, JONG-MIN; SONG, HO-YOUNG; JANG, SEONG-JIN
To: SAMSUNG ELECTRONICS CO., LTD.
Reel/Frame 029992/0673 →
Priority Claims (1)
KR 10-2012-0046419 · May 2, 2012 · national
Continuity (1)
Related Publication 20130294140A1 · Nov 7, 2013