Electro-optical assembly for silicon photonic chip and electro-optical carrier
An electro-optical device and method of assembly is disclosed. A first unit of the electro-optical device is positioned with respect to a second unit of the electro-optical device to pre-align an optical communication pathway between the first unit and the second unit. The first unit is positioned with respect to the second unit to pre-align an electrical communication pathway between the first unit and the second unit. The first unit is bonded to the second unit to assemble the electro-optical device to establish optical communication and electrical communication between the first unit and the second unit.
1. An electro-optical device, comprising:
a first unit having an optical coupling element and an electrical coupling element; and
a second unit including an electro-optical carrier having an electrical coupling element and a waveguide coupled to a surface of the electro-optic carrier;
wherein a direct electrical bond between the first unit and a surface of the electro-optical carrier of the second unit establishes an electrical communication pathway between the first unit and the second unit and aligns an optical communication pathway between the first unit and the second unit so that a waveguide of the second unit is substantially at a same height above the surface of the electro-optical carrier as an optical port of the first unit.
2. The device of claim 1 , wherein the first unit includes an optical element and the second unit includes an optical element and the optical element of the first unit is configured to pre-align with the optical element of the second unit for optical communication between the first unit and the second unit.
3. The device of claim 2 , wherein at least one of the optical coupling elements is selected from the group consisting of: an optical emitter; an optical receiver; an optical waveguide; a micro-lens; a micro-mirror; a diffractive element; and a diffractive grating coupler.
4. The device of claim 2 , wherein at least one of the optical coupling elements is configured to be one of: integrated into the first unit; coupled to the first unit; integrated into the second unit; and coupled to the second unit.
5. The device of claim 1 , wherein the first unit includes an electrical coupling element and the second unit includes an electrical coupling element and the electrical coupling element of the first unit is configured to align with the electrical coupling element of the second unit to establish an electric communication between the first unit and the second unit.
6. The device of claim 5 , wherein the first unit is configured to bond to the second unit via bonding the electrical coupling element of the first unit with the electrical coupling element of the second unit.
7. The device of claim 6 , wherein the optical elements are configured to broaden an optical beam to increase a mechanical positioning tolerance between the first unit and the second unit.
8. The device of claim 1 , wherein the first unit is a silicon photonic chip and the second unit is an electro-optical carrier.