IP Library › Granted Patent US 9,041,223
Granted Patent B2
US 9,041,223 · App. 13/610,050 · Granted May 26, 2015

Bump-on-trace (BOT) structures

Inventors: Yuh Chern Shieh (Taipei, TW); Han-Ping Pu (Taichung, TW); Yu-Feng Chen (Hsinchu, TW); Tin-Hao Kuo (Hsinchu, TW)
Assignee: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
H01L24/13H01L2224/16238H01L2224/81191H01L2924/01322H01L2224/05572H01L2224/13015H01L2224/13005H01L2224/17104H01L23/49838H01L24/16H01L2224/13013H01L2224/13014H01L2224/13082H01L2224/13147H01L2224/81424H01L2224/81444H01L2224/81447H01L2224/81455H01L2224/81464H01L2224/81815H01L2224/16104H01L2224/81484H01L2224/131H01L2224/16227H01L2924/00013H01L2924/01029H01L2224/16225
View Patent ↗
Loading inventors, assignments & file history…
Monitor This Case
Get email alerts when status or documents change.
Order Certified Copies
Most orders are placed with the USPTO same day — all within 24 business hours.
Order via The Patent Place →
Pre-filled with this patent's details
Quick Facts
Patent No.
US 9,041,223
App. No.
13/610,050
Granted
May 26, 2015
Kind
B2
Abstract

A bump-on-trace (BOT) structure is described. The BOT structure includes a first work piece with a metal trace on a surface of the first work piece, wherein the metal trace has a first axis. The BOT structure further includes a second work piece with an elongated metal bump, wherein the elongated metal bump has a second axis, wherein the second axis is at a non-zero angle from the first axis. The BOT structure further includes a metal bump, wherein the metal bump electrically connects the metal trace and the elongated metal bump. A package having a BOT structure and a method of forming the BOT structure are also described.

Claims (19)

1. A bump-on-trace (BOT) structure comprising:

a first work piece with a metal trace on a surface of the first work piece, wherein the metal trace has a first axis, wherein the first work piece is rigid, and an entirety of the metal trace is on the first work piece;

a second work piece with an elongated metal bump, wherein the elongated metal bump has a second axis, wherein the second axis is at a non-zero angle from the first axis; and

a metal bump, wherein the metal bump electrically connects the metal trace and the elongated metal bump.

2. The BOT structure of claim 1 , wherein the elongated metal bump has a first length extending in a first direction, the first length ranging from 10 microns (μm) to 1,000 μm.

3. The BOT structure of claim 2 , wherein the metal trace has a second length extending in a second direction, different from the first direction, the second length ranging from 10 μm to 10,000 μm.

4. The BOT structure of claim 2 , wherein the elongated metal bump has a first width extending in a second direction, different from the first direction, the first width ranging from 10 μm to 700 μm.

5. The BOT structure of claim 2 , wherein the metal trace has a second width extending in the first direction, the width ranging from 10 μm to 500 μm.

6. The BOT structure of claim 1 , wherein an angle between the first axis and the second axis ranges from 60-degrees to 120-degrees.

7. The BOT structure of claim 1 , wherein the elongate metal bump has a first half length extending beyond a first edge of the metal trace and a second half length extending beyond a second opposite edge of the metal trace, wherein the first half length is equal to the second half length.

8. The BOT structure of claim 1 , wherein the second work piece is an interposer.

9. The BOT structure of claim 1 , wherein the first work piece and the second work piece comprise active devices.

10. A method of making a bump-on-trace (BOT) structure, the method comprising:

forming a metal trace on a first work piece, wherein the metal trace has a first axis, the metal trace is formed completely on the first work piece, and the first work piece is rigid;

forming an elongated metal bump on a second work piece, wherein the elongated metal bump has a second axis, wherein the second axis is at a non-zero angle from the first axis; and

electrically connecting the metal trace with the elongated metal bump using a metal bump.

11. The method of claim 10 , wherein forming the elongated metal bump comprises forming the elongate metal bump to have the second axis at an angle with the first axis, the angle ranging from 60-degrees to 120-degrees.

12. The method of claim 10 , further comprising filling a space between the first work piece and the second work piece with a mold underfill.

13. The method of claim 10 , wherein electrically connecting metal trace with the elongated metal bump comprises reflowing a solder bump.

Assignments (1)
ASSIGNMENT OF ASSIGNOR'S INTEREST Recorded Sep 11, 2012
From: SHIEH, YUH CHERN; PU, HAN-PING; CHIEN, YU-FENG; KUO, TIN-HAO
To: TAIWAN SEMICONDUCTOR MANUFACTURING COMPANY, LTD.
Reel/Frame 028936/0087 →
Continuity (2)
Continuation 13095185 · Apr 27, 2011
Related Publication 20130001778A1 · Jan 3, 2013